Packaging & Bonding

MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.

The Wyko SP3200 is a gauge-capable advanced packaging profiling system for in-line process monitoring of flip-chip packaging.

The Disco DAD3240 is an automatic dicing saw used for cutting semiconductor wafers into individual chips or dies.

The West Bond K 1200 P is a semiconductor manufacturing equipment unit cataloged under asset number 136359.

The SUSS SB 6 E is a semi-automatic substrate bonder designed for aligned and unaligned wafer, substrate, and chip bonding using thermo-compression, anodic, fusion, adhesive, and related technologies.

The EVG 850 LT is an 8-inch bonder with wafer ID reader, prebond, IR inspection, plasma activation, and automated handling features.

The ASM Eagle AERO is an automatic ball wire bonding machine for high-end IC packaging, utilizing X-Power thermosonic bonding technology and capable of 22 µm bonded ball size.

The EVG 850 TB Temporary Wafer Bonder is a tool for temporary wafer bonding, supporting 6-inch wafers.

The Kulicke & Soffa AT Premier is a wire bonder used in semiconductor packaging and bonding.

The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.

The Datacon 2200 evo is a die bonder for epoxy die attach applications.

The Esec 2100 SC is a die bonder platform in Besi's Esec 2100 family. The Esec 2100 SC is described as a flexible 300 mm high-speed platform for epoxy die attach applications.

The Sumitomo SE 75 DU is a horizontal injection molding machine.

The ESEC ESEC_2100HS is an automatic epoxy die bonder. The ESEC ESEC_2100HS appears in the category of semiconductor assembly die bonders.

The Sumitomo SV 18 is a vertical injection molding machine described with picker machine, auto-gate cutting, conveyor, and MTC.

The Sumitomo SH 100 NIV.A is a horizontal injection molding machine described as a picker machine with auto-gate cutting, a conveyor, MTC, and mold.

The WestBond 7476 D 79 is a manual wedge-wedge wire bonding system used to create electrical interconnections between microfabricated devices, semiconductor chips, and external packages.

The K&S Maxum Plus is a wire bonder manufactured by K&S.

The Kulicke & Soffa 4124 Ball is a ball wire bonder for semiconductor packaging and bonding applications.

The West Bond 10490 is a convertible bonder that can be configured for wedge or ball bonding.

The West Bond 7KF Series is a manual wire bonder line for microelectronics packaging, and West Bond says it has designed and manufactured its wire bonding and die attach equipment since 1966.

The Palomar 3880-II is a highly flexible automated die bonder for R&D through volume production.

The EV Group EV 501 is a wafer bonder that performs anodic bonding, used to seal Pyrex wafers to silicon microfluidic channels.

VIEW PR-1 was introduced in 1978 as a binary image, pattern recognition system for automated wirebonding machines and wafer probers.

The VIEW 1101 was a second-generation binary image pattern recognition system introduced in 1982 for automated wirebonding machines and wafer probers.

The West Bond 3700E is a wire bonder model listed as a convertible auto 3700E wirebonder.

The West Bond 4500 is a wire bonder listed among West-Bond wire bonder models.

The West Bond 7416 is a wire bonder listed among West-Bond wire bonder models.

The Besi / Datacon Fico MMS X is a molding machine used in semiconductor packaging and bonding.

The West Bond 7700 is a wire bonder line that is explicitly listed among West-Bond wire bonder models.

The West Bond 7327A is a thermocompression wedge manual wire bonder.

West-Bond 7400A is a manual wedge wire bonder line that includes vertical-feed and ultrasonic feed configurations.

The Shinkawa UTC 3000 is a wire bonder used in semiconductor packaging and bonding applications.

The K&S WB Max Ultra is a wire bonder used in semiconductor packaging and bonding.

The XBS300 is a SUSS MicroTec system for temporary bonding of wafers.

The SUSS XBC300 Gen2 D2W is a permanent bonding system offered by SUSS MicroTec.

The SUSS XBS300 W2W is a wafer bonding system for permanent and temporary bonding applications.

The SB8 Gen2 is part of SUSS MicroTec's high-precision bonding solutions, built on a scalable, modular platform for reliable permanent bonding outcomes.

The Shinkawa SBB 1410 is a stud bump bonder produced by Shinkawa for semiconductor packaging and bonding applications.

The MRSI 505 is an ultra-precision, vision-guided, fully automatic, high-speed robotic assembly work cell used for semiconductor pick-and-place and bonding applications.

The SUSS XBS200 is a permanent bonding system from SUSS MicroTec.

The Nordson / Dage 4000 TPAXY is an automated bond-testing system.

The Besi Esec 2100 FC is a flip chip die bonder capable of 8 µm placement accuracy and up to 16,000 UPH.

The SUSS XBC300 Gen2 D2W/W2W is a high-precision bonding system built on a scalable, modular platform for temporary, permanent, and hybrid bonding.

The Nordson / Dage BT 4000 W is a manually loaded bond tester equipped with a DAGE SE MS0158 special image capture camera, a BS250-R cartridge, and a calibration jig and weights.

The West Bond 7700A is an ultrasonic ball and wedge wire bonder. The West Bond 7700A is also listed as a manual ball bonder and a manual thermosonic gold ball wire bonder.

The West Bond 7700B is a ball bonder.

The SUSS MicroTec SB6 / 8 Gen2 is a semi-automated wafer bonding system capable of handling wafers up to 200 mm.

The SUSS MicroTec XB8 is a semi-automated wafer bonding system for substrates up to 200 mm, supporting high-force wafer bonding.

The ELD300 is a semi-automated excimer laser-assisted debonding system for wafers up to 300 mm.

The Palomar 6500 Die Bonder is a compact die bonder for ultra-high accuracy eutectic and adhesive placements with cycle times under seven seconds.

The Esec 2008 HS 3 P is a die bonder used in semiconductor packaging and bonding.

The ASM AD 896 M is a die bonder.

The Sumitomo SE 75 DUZ Injection is an injection molding machine in the Packaging & Bonding category.

The Finetech Fineplacer Lambda is a sub-micron die bonder used for precise placement and bonding of components onto substrates.

The K&S Rapid Automatic Wire Bonder is an automatic wire bonding system that operates on single-phase 50/60 Hz power.