SUSS MicroTec
SB6 / 8 Gen2
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS MicroTec SB6 / 8 Gen2 is a semi-automated wafer bonding system for wafers up to 200 mm. The SB6 / 8 Gen2 performs wafer bonding.[1]
What it is
How it works
Wafer bonding systems join two or more substrates together using processes such as anodic bonding, fusion bonding, adhesive bonding, metal diffusion bonding, or eutectic bonding.[1]
The system supports bond alignment, which can be performed through top-side or bottom-side alignment, as well as infrared alignment for specific applications.[1]
The equipment handles fragile, thin, or warped wafers, providing edge handling and non-contact pre-alignment for delicate substrates.[1]
Where it fits in the process flow
Applications
Application areas include microelectromechanical systems (MEMS), light-emitting diodes (LEDs), and advanced packaging such as flip-chip, wafer-level chip-scale packaging, and 2.5D/3D integration.[1]
The system supports bonding of materials like benzocyclobutene (BCB) and polyimide, as well as high-topography substrates with features up to several hundred micrometers.[1]
- Wafer Bonding
What do the numbers mean?
Wafer handling1
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Is the SB6 / 8 Gen2 fully automated or semi-automated?
The SB6 / 8 Gen2 is a semi-automated system.[1]
What types of wafer bonding does the SB6 / 8 Gen2 support?
The system supports permanent bonding and temporary bonding, including processes such as anodic bonding, fusion bonding, adhesive bonding, and eutectic bonding.[1]
Not publicly documented
The following facts about the SB6 / 8 Gen2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the SB6 / 8 Gen2 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SB6 / 8 Gen2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SB6 / 8 Gen2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SB6 / 8 Gen2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SB6 / 8 Gen2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]hilpert.ch — hilpert.chhilpert.ch
Last updated Sep 22, 2026.
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