SUSS MicroTec
SB6 / 8 Gen2 alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
EV Group
850 LT SOI Fusion Wafer
200mm
Packaging & Bonding
The EV Group 850 LT SOI Fusion Wafer Bonder is a fully automatic wafer bonder configured for 8-inch/200mm wafers.
Disco
dad3240-dicing-saw
200mm
Packaging & Bonding
The Disco DFL7340 stealth dicing system is used for dicing silicon wafers and is dedicated to Si wafers only.
Disco
DFL7340-stealth-dicer
200mm
Packaging & Bonding
The Disco DFL7340 stealth dicing system is used for dicing silicon wafers and is dedicated to Si wafers only.
EV Group
Gemini Automated Production Wafer
200mm
Packaging & Bonding
The EVG Gemini Automated Production Wafer Bonder is a wafer bonder with face-to-face alignment and automation features, supporting wafers up to 8"/200mm.
SUSS MicroTec
XB8
200mm
Packaging & Bonding
The SUSS MicroTec XB8 is a semi-automated wafer bonding system for substrates up to 200 mm, supporting high-force wafer bonding.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
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