SUSS MicroTec

The ACS200 Gen3 Industrial is a SUSS MicroTec coating and developing system. The ACS200 Gen3 Industrial is listed among SUSS coating solutions.

The SUSS AS 8 Spray Coater is a semi-automatic spray coater for substrates up to 200mm or 300mm in diameter and square substrates up to 6 inches edge length.

The SUSS MicroTec MA 8 / BA 6 Wafer is a wafer aligner categorized under Lithography.

The SUSS SB 6 E is a semi-automatic substrate bonder designed for aligned and unaligned wafer, substrate, and chip bonding using thermo-compression, anodic, fusion, adhesive, and related technologies.

The SUSS 80 T 3 is a spin coater.

The SUSS Falcon ACS 200 is a coater/developer cluster system for wafer processing.

The SUSS MicroTec MJB4 is a manual mask/wafer aligner for research and development that aligns and exposes wafers up to 4 inch (100 mm) diameter.

The SUSS ACS200 GEN3 is a modular cluster tool for coating and development of i-line photoresists.

The SUSS MA 200 is a semi-automatic mask aligner capable of processing wafers up to 8 inches in diameter, using UV400 optics and a 365/405 nm sensor.

The SUSS 150 e is a mask aligner manufactured by SUSS MicroTec.

The SUSS PA 200 is a semi-automatic wafer prober for precision semiconductor wafer testing and electrical measurement.

The SUSS Delta BM 20 is a coater.

The SUSS P 8 is a manual probe station prober.

The SUSS ACS 300 Gen 2 is a coater/developer system.

The ACS300 Gen3 is an automated coating and developing system for wafers up to 300 mm.

The MJB55 is a mask aligner developed by SUSS MicroTec (then Karl Süss) for photolithography in mass production.

The SUSS MicroTec ECD8 is a coating and developing system listed within SUSS's Coating Solutions portfolio.

The MA12 Gen3 is a mask alignment system for photolithography listed under SUSS MicroTec's imaging solutions.

The XBS300 is a SUSS MicroTec system for temporary bonding of wafers.

The SUSS XBC300 Gen2 D2W is a permanent bonding system offered by SUSS MicroTec.

The SUSS XBS300 W2W is a wafer bonding system for permanent and temporary bonding applications.

The SB8 Gen2 is part of SUSS MicroTec's high-precision bonding solutions, built on a scalable, modular platform for reliable permanent bonding outcomes.

The SUSS MicroTec LP50 is an inkjet printing solution for semiconductor manufacturing.

The SUSS MicroTec NIL-SFT8 Series is a mask alignment system listed under the company's imaging solutions product portfolio.

The SUSS XBS200 is a permanent bonding system from SUSS MicroTec.

The LabSpin6 / 8 is a manual coating and developing system for substrates up to 200 mm, capable of spin coating and puddle developing.

The HP8, CP8, and VP8 are manual coating and developing systems from SUSS MicroTec, supporting wafers up to 200 mm and offering baking, cooling, and vapor priming capabilities.

SUSS MicroTec SD12 is a manual coating and developing system for wafers up to 300 mm that supports solvent processes, puddle and spray developing, lift-off, and wafer cleaning.

The SUSS XBC300 Gen2 D2W/W2W is a high-precision bonding system built on a scalable, modular platform for temporary, permanent, and hybrid bonding.

The DSC300 Gen3 is a UV scanning mask alignment system from SUSS MicroTec.

The SUSS MicroTec AS8 / 12 is a manual coating and developing system for wafers up to 300 mm, with spray coating as its primary process.

The SUSS MicroTec DSC300 Gen2 is an automated full-field scanning projection lithography system for wafers up to 300 mm.

The DSC500 is an automated, full-field scanning projection lithography system from SUSS MicroTec for substrates up to 450 x 500 mm.

The SUSS MicroTec ELP300 Gen2 is an automated excimer laser processing system for substrates up to 300 mm, used for ablation, laser-assisted debonding, and seed layer removal.

The SUSS MJB 4 Mask Aligner is a mask aligner used for contact exposure and alignment, with source-stated support for wafers up to 4 inches in diameter.

The SUSS MicroTec SB6 / 8 Gen2 is a semi-automated wafer bonding system capable of handling wafers up to 200 mm.

The SUSS MicroTec XB8 is a semi-automated wafer bonding system for substrates up to 200 mm, supporting high-force wafer bonding.

The ELD300 is a semi-automated excimer laser-assisted debonding system for wafers up to 300 mm.

The SUSS MicroTec Delta 12 AQ is an automated photoresist developer station that supports temperature controlled spray photoresist development.

The SUSS MicroTec MA/BA6 is a contact aligner for broadband lithography with backside alignment capability.

The SUSS Delta 80 Spin is a spin coater/developer with a 3 phase + N + PE, 400 V, 50 Hz power specification and no software included.

The SUSS MicroTec PA 200 HS Blueray is a test and probe tool. The PA 200 HS Blueray includes a control module, joystick, transformer, microscope, light source, XYZ prober Cascade Micro Positioner assemblies, probe arm and prober holder assemblies, and an isolation table.

The SUSS MJB 3 350 W is a mask aligner for 3-inch wafers.

The SUSS MA 4 Mask is a mask aligner used in lithography processes.

The SUSS MicroTec MCS8 is a coating and developing system listed in the SUSS MicroTec products and solutions portfolio.

The SUSS RC 5 is a spin coater.

The SUSS Falcon is a wafer backside rinse developer system configured for 6-inch to 8-inch wafers.

The SUSS MA 14 Mask Aligner is a mask aligner used in lithography for semiconductor manufacturing, MEMS R&D, and micro-nano structure fabrication.

The SUSS FC 150 is a flip chip bonder used for bonding semiconductor chips to substrates.

The SUSS MicroTec MA 12 is a semi-automated mask aligner for proximity exposure, supporting wafers up to 300 mm, with mask alignment and exposure capabilities.

The MA / BA Gen4 Pro Series is a semi-automated mask aligner and bond aligner system supporting wafers up to 150 mm / 200 mm, with capabilities for exposure, UV bonding, fusion bonding, micro- and nanoimprinting, and selective plasma activation.

The SUSS MicroTec AD12 is a manual system for aqueous developing and wafer cleaning, handling wafers up to 300 mm.

The MA100 / 150e Gen2 is an automated mask aligner for proximity exposure, supporting wafer sizes up to 150 mm.

The MA300 Gen2 is an automated mask aligner from SUSS MicroTec for proximity exposure of wafers up to 300 mm.

The SUSS MicroTec DSM 200 Overlay Measurement is a double-sided overlay measurement system used for metrology and inspection on semiconductor wafers.