SUSS MicroTec
XBC300 Gen2 D2W/W2W
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS XBC300 Gen2 D2W/W2W is a high-precision bonding system for die-to-wafer and wafer-to-wafer processes. The XBC300 Gen2 D2W/W2W is built on a scalable, modular platform that adapts to customer needs for optimal device quality and maximum yield.[1]
What it is
The XBC300 Gen2 D2W/W2W is a permanent bonding system from SUSS MicroTec.[1]
How it works
General reference — not yet source-verifiedDie-to-wafer and wafer-to-wafer bonding systems typically employ thermocompression, hybrid bonding, or other permanent joining methods to attach one substrate to another with precise alignment and controlled force and temperature.
Such systems often include alignment modules, bond heads, and process chambers that manage the environment (e.g., vacuum or inert gas) to ensure bond quality and minimize defects.
Applications
General reference — not yet source-verifiedOther application areas include heterogeneous integration of different material systems (e.g., III-V with silicon), memory stacking (e.g., HBM), and fan-out wafer-level packaging.
- die-to-wafer (D2W) bonding
- wafer-to-wafer (W2W) bonding
- temporary bonding
- permanent bonding
- hybrid bonding
What do the numbers mean?
Wafer handling1
Configuration & options2
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| XBC300 Gen2 D2W | — | — | Supports only die-to-wafer (D2W) bonding on the XBC300 Gen2 platform. | suss.com[1] |
What replaced it?
Related models
- siblingSUSS MicroTec XBC300 Gen2 D2W— The XBC300 Gen2 D2W is a variant of the XBC300 Gen2 platform for die-to-wafer bonding.source[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Is the XBC300 Gen2 D2W/W2W a bonding system?
Yes, the XBC300 Gen2 D2W/W2W is a permanent bonding system.[1]
Not publicly documented
The following facts about the XBC300 Gen2 D2W/W2W are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the XBC300 Gen2 D2W/W2W are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the XBC300 Gen2 D2W/W2W are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the XBC300 Gen2 D2W/W2W are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the XBC300 Gen2 D2W/W2W is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the XBC300 Gen2 D2W/W2W are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]suss.com — suss.comsuss.com
Last updated Sep 22, 2026.
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