West Bond
10490
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The West Bond 10490 is a Convertible Bonder that can be used for wedge or ball bonding. The West Bond 10490 is a semiconductor assembly tool used for wire bonding.[1]
What it is
How it works
General reference — not yet source-verifiedBoth bonding methods require precise control of bond force, ultrasonic power, and time parameters to achieve reliable joints. The machine uses a wire clamp and a wire feed system to advance the wire for each subsequent bond.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor assembly, wire bonding is a second-level interconnect step that follows die attach. The West Bond 10490 is used to connect the bond pads on the die to the leadframe or substrate of a package. After wire bonding, the assembly typically proceeds to encapsulation or molding.
Wire bonding is widely employed in the packaging of integrated circuits, discrete semiconductors, light-emitting diodes, and microelectromechanical systems where direct chip-to-substrate connections are required.
Applications
General reference — not yet source-verifiedTypical applications include bonding of IC packages, hybrid circuits, power devices, and sensor modules that use standard wire diameters.
What do the numbers mean?
Configuration & options6
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 10490 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 10490 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 10490 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 10490 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 10490 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 10490 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]fabsurplus.com — fabsurplus.comfabsurplus.com
- [2]Inventory photo
- [3]waferpedia.com — waferpedia.comwaferpedia.com
- [4]West Bond 10490 Bonder — wotol.comwotol.com
Last updated Oct 5, 2026.
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