SUSS MicroTec
MA/BA6
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The SUSS MicroTec MA/BA6 is a contact aligner for broadband lithography. The SUSS MicroTec MA/BA6 has backside alignment capability. The SUSS MicroTec MA/BA6 supports substrates up to 150 mm diameter.[1][2][3]
Vacuum
0.6 µm in vacuum contact mode[4]
Performance
Backside alignment capability[1]
Optics
150 mm diameter[2]
What it is
General reference — not yet source-verifiedMask aligners are photolithography tools used to align a photomask with a substrate coated with photoresist and then expose the resist to ultraviolet light. Contact aligners bring the mask into direct physical contact with the substrate during exposure to achieve high resolution.
How it works
The MA/BA6 supports multiple exposure modes including vacuum contact, hard contact, and soft contact. Alignment can be performed manually or with software assistance. The exposure lamp provides g-line (436 nm), h-line (405 nm), i-line (365 nm), and broadband UV (350–450 nm) wavelengths. A removable i-line band pass filter can be inserted in the light path to produce steep resist edges. The maximum substrate thickness the system can handle is 10 mm.[2][3][4]
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor and microdevice fabrication, photolithography is the step that transfers a pattern from a photomask to a photosensitive film (photoresist) on a substrate. The MA/BA6 is used in this lithography step after the substrate has been cleaned and coated with photoresist, and before the resist is developed. After exposure and development, the patterned resist serves as a mask for subsequent etching, deposition, or ion implantation steps. The tool is also used for multi-layer alignment where successive patterns must be registered to earlier layers.
What can it run?
Process applications and technology nodes documented for this tool.
- Broadband lithography
What do the numbers mean?
Vacuum & pumping2
Wafer handling4
Optics & imaging11
Performance4
Configuration & options7
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MA/BA6 Gen4 | — | — | — | nist.gov[2] |
| SUSS MicroTec MA/BA6 Gen4 Mask Aligner | — | — | Described with 1 µm feature size, 350 W mercury lamp, 6 in. diameter exposure area, 2 in. to 6 in. photomask support, and optional vacuum contact, hard contact, and soft contact modes. | imseam.uni-heidelberg.de[4] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What exposure wavelengths does the MA/BA6 support?
The tool supports g‑line (436 nm), h‑line (405 nm), i‑line (365 nm), and UV broadband (350 nm–450 nm).[2]
What exposure modes are available on the MA/BA6?
The tool supports vacuum contact, hard contact, and soft contact exposure modes.[4]
What are typical applications of the MA/BA6?
Typical applications include medical devices, biofluidic devices, microelectromechanical systems (MEMS), thermal sensors, and printing micrometer‑size and larger features.[2]
Not publicly documented
The following facts about the MA/BA6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the MA/BA6 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the MA/BA6 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the MA/BA6 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the MA/BA6 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the MA/BA6 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]cnsi.ucsb.edu — cnsi.ucsb.educnsi.ucsb.edu
- [2]nist.gov — nist.govnist.gov
- [3]nff.gmu.edu — nff.gmu.edunff.gmu.edu
- [4]imseam.uni-heidelberg.de — imseam.uni-heidelberg.deimseam.uni-heidelberg.de
Last updated Oct 5, 2026.
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