Wyko
SP3200
The Wyko SP3200 is an advanced packaging profiling system. The Wyko SP3200 is designed to improve in-line process monitoring of flip-chip packaging. The Wyko SP3200 functions as both a surface metrology tool and a defect inspection tool.[1]
What it is
How it works
Where it fits in the process flow
Applications
The Wyko SP3200 is used in flip-chip packaging inspection and metrology.[1]
The Wyko SP3200 is used to monitor advanced packaging substrates and to assess bump-related features on packaged assemblies.[1]
- In-line process monitoring of flip-chip packaging
- Advanced packaging substrates
What do the numbers mean?
Control & software2
- Software features
- Specialized algorithms, automation scripting language, integrated database, automatic data logging, and real-time go/no-go feedback[2]
Dimensions & facilities2
Configuration & options10
What replaced it?
Related models
- siblingWyko SP3000— Listed alongside the SP3200 in the product lineup.source[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the Wyko SP3200 used for?
It is designed for in-line process monitoring of flip-chip packaging, combining surface metrology and defect inspection functions for advanced packaging substrates.[1]
What defects can the Wyko SP3200 detect?
It automatically detects solder bridges, under and oversized bumps, missing and extra solder bumps, and bump position.[1]
What measurements does the Wyko SP3200 calculate?
It calculates bump height, diameter, volume, and three-point and regression coplanarity.[1]
Not publicly documented
The following facts about the SP3200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SP3200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SP3200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SP3200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SP3200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SP3200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]web.archive.org — web.archive.orgweb.archive.org
- [3]Veeco Products - Show All Products — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.
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