HVM1

Die bonders are machines used in semiconductor assembly to pick individual dies from a wafer or carrier and place them onto a substrate, leadframe, or package, aligning them with accuracy before bonding them in place through eutectic, epoxy, or other attachment methods.

The MRSI HVM1 offers several process choices for die bonding, including eutectic bonding, epoxy stamping, UV epoxy dispensing, and in-situ UV curing. The machine is available in a conveyor version that includes an inline conveyor for single fixture or multiple cassette inputs, which can automatically transport large forms of carriers such as those used for Active Optical Cables (AOC) or chip-on-PCB applications, as well as gold-box packaging and chip-on-carrier assembly in fixtures.^[1]

A heated head version of the MRSI HVM1 adds a heated head on the right side while the left side retains the standard head. The localized top heating can operate at a fixed temperature or with pulsed heating; this feature is specifically designed for eutectic bonding of multiple dies onto a common carrier without reflowing neighboring solder pads.^[1]

In a semiconductor assembly line, a die bonder such as the MRSI HVM1 receives singulated dies after wafer dicing (typically on tape or in waffle packs) and places them onto the appropriate substrate, carrier, or package base. The bonded assembly then moves to downstream processes such as wire bonding, encapsulation, or further assembly steps.

The MRSI HVM1 is designed for specific assembly applications including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) bonding using eutectic or epoxy stamping methods. The machine also supports applications such as Active Optical Cables (AOC), gold-box packaging, and similar chip-on-PCB or fixture-based assemblies.^[1]