Palomar

6500

Research Quality: 50% complete

The Palomar 6500 Die Bonder is an automated die bonder for microelectronic assembly. The 6500 Die Bonder performs ultra-high accuracy eutectic and adhesive placements with cycle times under seven seconds. The 6500 Die Bonder uses a four-axis positioning system driven by linear motors gliding over air bearings on a steel based frame.^[1]^[2]^[3]^[4]^[5]

6500 — web.archive.org — Fig. 016500web.archive.org^[1]

Plate 016500 Die Bonder overview
Palomar TechnologiesWatch on YouTube
Plate 02Palomar 6500 High Precision Component Placement Die Bonder
Palomar TechnologiesWatch on YouTube
Plate 03Edge Emitting Laser Chip Epi-Side Down Flip Chip Eutectic Attach on 6500 Die Bonder
Palomar TechnologiesWatch on YouTube

How it works

Die bonders pick and place individual semiconductor die onto substrates using a bond head that applies force, heat, or ultrasonic energy. The Palomar 6500 employs a four-axis positioning system with linear motors on air bearings, enabling precise motion.^[1]^[2]^[3]^[4]^[5]

Applications

The Palomar 6500 Die Bonder targets high-precision applications in optoelectronics, RF power devices, hybrid microelectronics, and MEMS. Specific applications include P-side down laser diode attachment, silicon bench (V-groove) placement, high-density RF power transistors, ultra-fine pitch hybrid assemblies, MEMS components, VCSEL modules, data storage devices, high-brightness/high-power LED arrays, optoelectronic packaging, LED printhead attachment, and solar concentrator packaging.^[1]^[2]^[3]^[4]^[5]

P-side down laser diode attachment
Silicon bench (V-Groove) placement
High-density RF power transistors
Ultra-fine pitch hybrid assemblies
MEMS components
VCSEL modules
Data storage
High-bright/high-power LED arrays
Optoelectronic packaging
LED printhead attachment
Solar concentrator packaging

What do the numbers mean?

Performance2

Placement capability: Ultra-high accuracy eutectic and adhesive placements^[1]2 sources
Placement Accuracy: Ultra-high^[1]

Configuration & options11

Machine type: Die bonder^[1]
Positioning system: Four-axis positioning system^[1]2 sources
Drive mechanism: Linear motors gliding over air bearings^[1]
Frame: Steel based frame^[1]2 sources
Cycle time: Under seven seconds^[1]2 sources
Positioning system: Four-axis positioning system driven by linear motors gliding over air bearings on a steel based frame^[1]
Cycle Time: Under 7 seconds^[1]
Positioning Axes: Four-axis^[1]
Drive System: Linear motors with air bearings^[1]
Frame Material: Steel^[1]
Supported Processes: Silver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste Die Bonding^[2]

Interested in this tool?

Need help with this tool?Embed spec card

What replaced it?

siblingPalomar 6532HP— Listed as a next model in navigation alongside the 6532HP.source^[6]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What positioning system does the 6500 Die Bonder use?

The 6500 Die Bonder uses a four-axis positioning system driven by linear motors gliding over air bearings on a steel based frame.^[1]

What cycle times does the 6500 Die Bonder achieve?

The 6500 Die Bonder performs placements with cycle times under seven seconds.^[1]

What types of placement does the 6500 Die Bonder support?

The 6500 Die Bonder performs ultra-high accuracy eutectic and adhesive placements.^[1]

Not publicly documented

The following facts about the 6500 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6500 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 6500 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 6500 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 6500 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 6500 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (7)Every fact above is drawn from these public sources

[1]web.archive.org — web.archive.orgweb.archive.org
[2]web.archive.org — web.archive.orgweb.archive.org
[3]web.archive.org — web.archive.orgweb.archive.org
[4]6500 Die Bonder — palomartechnologies.compalomartechnologies.com
[5]6500 Die Bonder Data Sheet — palomartechnologies.compalomartechnologies.com
[6]web.archive.orgweb.archive.org
[7]PALOMAR 6500 - Palomar Technologies, Inc | Die Bonder — semiconductor.directorysemiconductor.directory