Palomar

The Palomar 1200 is a eutectic die attach oven.

The Palomar 3880-II is a highly flexible automated die bonder for R&D through volume production.

The Palomar 6500 Die Bonder is a compact die bonder for ultra-high accuracy eutectic and adhesive placements with cycle times under seven seconds.

The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder driven by voice coil technology in the bond head.

The Palomar 2460 V is a wire bonder.

The Palomar 8000 is a wire bonder / bonder with source-listed vintages from 2009 and 2010.

The Palomar 3500 II CE is a bonder in the Packaging & Bonding category.

The Palomar 3100 is a eutectic die attach oven.

The Palomar LCC 8000 Wire Bonder & Ball Bumper is a packaging and bonding tool.

The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder driven by voice coil technology in the bond head.

The Palomar 8000 i is a wire bonder and ball bumper for complex, high-mix automated production. The Palomar 8000 i is a fully automated thermosonic high-speed, ball-and-stitch wire bonder with ball bumping, stud bumping, wafer bumping, chip bumping, and customized looping profiles.

The Palomar 2470 V is a wire bonder manufactured by Palomar.

The Palomar 2100 Ultrasonic Monitor is an ultrasonic monitor that includes a carrying case and rod.

The Palomar 6532HP is a high-performance die bonder designed for precise, high-volume device assembly in the photonics market.

The Palomar 3500-R is a factory refurbished die bonder with a bonder performance upgrade, a Cognex vision system, and an 8-position tool turret.

The Palomar 3880 is a component placement die attach system described as a multiple die bonder with an integrated Z-Theta bidirectional 8-tool bond head.