Palomar
3880
The Palomar 3880 is a component placement die attach system. The Palomar 3880 features an integrated Z-Theta bidirectional 8-tool bond head. The Palomar 3880 supports eutectic die attach, epoxy die attach, and flip chip.[1][2]
Plate 01Palomar 3880-II Die Bonder
Palomar TechnologiesWatch on YouTubePlate 02Palomar Technologies' 3880 Die Bonder Component Placement Die Attach System
Palomar TechnologiesWatch on YouTube
What it is
How it works
Where it fits in the process flow
Applications
The Palomar 3880 is applied to active optical cable assembly, chip-on-board assembly, HB and HP LED assembly, microwave modules, RF packages, hybrid microcircuits, MEMS and MOEMS, VCSEL, photodiode, and DFB laser work, lens attach, solid-state lasers, RF GaN power amplifiers, LED printhead attachment, and RF power amplifier assembly.[1][2]
The Palomar 3880 supports silver sintering die bonding, eutectic die bonding, epoxy die bonding, UV die bonding, solder paste die bonding, and thermocompression die bonding.[1][2]
- AOC - Active optical cable
- Chip-on-board
- HB/HP LED assembly
- Microwave modules
- RF packages
- Hybrid microcircuits
- MEMS / MOEMS
- VCSEL, PD, DFB laser, lens attach
- Solid state lasers
- RF GaN 5G power amplifiers
- LED printhead attachment
- RF power amplifier
- Optoelectronic/photonics packages
What do the numbers mean?
Wafer handling1
- Machine use in services
- Used for wafer (up to 12") deep access wafer sealing applications[3]
Configuration & options7
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Why is precision important in this equipment class?General reference — not yet source-verified
The parts being handled are small and fragile, so accurate placement and controlled bonding are needed to avoid damage and ensure reliable electrical connection.
Not publicly documented
The following facts about the 3880 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3880 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3880 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3880 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3880 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3880 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]3880 Die Bonder — web.archive.orgweb.archive.org
- [3]web.archive.org — web.archive.orgweb.archive.org
Last updated Oct 5, 2026.
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