West Bond
7372 B
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedDie bonders typically pick a die from a wafer or tape, align it using optical vision, and place it onto a substrate with controlled force and temperature.
The placement head may include a heated collet or vacuum pickup.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding occurs after wafer dicing and before wire bonding or encapsulation.
The die bonder receives singulated die from a dicing tape or waffle pack, and after die bonding the assembly moves to wire bonding for electrical connections.
Applications
General reference — not yet source-verifiedDie bonders are used for a wide range of semiconductor devices including integrated circuits, power devices, MEMS, LEDs, and optoelectronics.
What do the numbers mean?
Configuration & options1
- With StereoZoom microscope[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 7372 B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the 7372 B are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7372 B are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7372 B are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7372 B are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7372 B are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]inventory listing
Last updated Sep 10, 2026.
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