Deposition

The Denton SJ20C is an electron-beam evaporation tool used for physical vapor deposition of a wide range of materials.

The Applied Materials Centura Ultima+ HDP is a chemical vapor deposition system for 6-inch wafers, equipped with an ENI AM200 RF generator.

The Denton Explorer 14 RF Sputterer is an RF sputterer manufactured by Denton Vacuum.

The Lam / Novellus / Gasonics Triple Speed NF is a chemical vapor deposition (CVD) system with three HDP chambers, a Brooks robot, SLM type, three ports, and loadlock helium reduction.

The Applied Materials Producer III is a chemical vapor deposition (CVD) system.

The Varian CC2 is a vacuum gauge controller that is part of the Denton Discovery 18 sputter deposition system.

The SPTS Multiplex is a plasma-enhanced chemical vapor deposition (PECVD) system manufactured by SPTS/STS.

The Ulvac CME 200 J is a plasma-enhanced chemical vapor deposition (PECVD) system.

Oxford Instruments 800 Plus is a PECVD (Plasma-Enhanced Chemical Vapor Deposition) system.

The Plasma-Therm Versaline is a semiconductor processing platform used for plasma-enhanced chemical vapor deposition (PECVD) and deep reactive-ion etching (DRIE), configured for 4-inch wafers.

Applied Materials Endura 2 is a 12-inch PVD (physical vapor deposition) system used for liner/barrier and front-end metallization applications.

The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.

The Tokyo Electron Trias Metal is a semiconductor processing system that supports metal chemical vapor deposition (CVD) for Ti/TiN and metal etching, and handles 300 mm (12-inch) wafers.

The CEE 100 CB Spin is a spin coater from the CEE 100 family.

The TEL Trias is a plasma nitridation deposition system handling 8-inch and 12-inch wafers.

The Lam VEXP is a chemical vapor deposition (CVD) system manufactured by Lam Research.

The Tokyo Electron Alpha 6 S is a batch processing deposition system introduced in 2000, with a variant configured for low-pressure silicon nitride CVD on 8-inch wafers.

The Applied Materials Centura Ultima TE HDP is a high-density plasma chemical vapor deposition (HDP CVD) system for 8-inch wafers, configured with one Ultima TE chamber, two DxZ nitride chambers, one wafer orienter chamber, and one multi-slot cooldown chamber.

Applied Materials Charger UMB is a PVD (physical vapor deposition) mainframe with 3 chambers and compatibility with Endura.

The Aixtron AIX 2800 G 4 WW is a metal organic chemical vapor deposition (MOCVD) reactor designed for processing 8-inch wafers.

The Aixtron AIX R 6 is a metal organic chemical vapor deposition system.

The CHA SSC-1000 is a multi-station sputtering system configured with up to four RF or DC cathodes.

The Perkin Elmer 4410 is a sputtering system.

Applied Materials Producer GT APF is a PECVD (plasma-enhanced chemical vapor deposition) system.

The Applied Materials Producer XP APF Kodiak is a plasma-enhanced chemical vapor deposition (PECVD) system for 300mm wafers with three Kodiac chambers.

The Applied Materials Endura 300 Aluminum Interconnect is a physical vapor deposition (PVD) system designed for 300 mm (12 inch) wafers.

The Applied Materials Endura CL Versa is a physical vapor deposition system from the Endura family, configured with TTN 3CH + Degas STD 2CH.

The Applied Materials Endura 300 is a PVD (Physical Vapor Deposition) system configured for 300mm wafers.

The Trion Titan Loadlock is a plasma deposition system configured for 3-inch wafers.

Applied Materials Centura HP is a PVD (Physical Vapor Deposition) system for 8-inch wafers.

The Applied Materials Impulse is a PVD system used for sputtering on 12 inch wafers.

The Tystar Tytan 1600 LPCVD is a low pressure chemical vapor deposition system.

The Angstrom NexDep Thermal E-Beam Evaporator is a physical vapor deposition tool that offers e-beam and thermal evaporation, with NexDep 2 also offering ion assisted deposition.

CHA Industries’ 635 Series modular deposition systems support both sputtering and evaporation for semiconductor and compound semiconductor wafer coating.

The STS Multiplex is a PECVD deposition system for 6-inch wafers, processing silicon nitride with gases including oxygen, carbon tetrafluoride, silane, nitrous oxide, and ammonia.

The MKS 660 is a sputter deposition system for metals, alloys, and insulating thin films with a 6-inch diameter stage.

The Applied Materials Producer SE is a 300mm wafer chemical vapor deposition (CVD) system, offered in both standard CVD and plasma-enhanced CVD (PECVD) configurations.

The Angstrom Engineering EvoVac is a load-locked PVD tool for electron-beam evaporation, with additional resistive thermal evaporation, ion-assisted deposition, and sputter deposition capabilities.

The Oxford Ion Beam Deposition System is a deposition tool using DC hot wire filament ion-guns.

The Ulvac EBX 2000 is a high vacuum evaporation system manufactured by Ulvac, with a reported vintage of 2005.

The Lam Research (Novellus) Concept Two Dual Sequel is a chemical vapor deposition (CVD) system.

The CHA Solution E-Beam Evaporator is an E-beam evaporator with a listed Glassman power supply.

Applied Materials Centura DxZ is a CVD (Chemical Vapor Deposition) equipment line.

The Applied Materials P 5000 Mark II DLH is a plasma-enhanced chemical vapor deposition (PECVD) system for 6-inch wafers.

The Applied Materials Centura is a semiconductor processing platform used for chemical vapor deposition (CVD) and etching.

Oxford Instruments FlexAL is an atomic layer deposition system compatible with TiN, TaN, TiO, TaO, and SiN.

The Denton Vacuum Discovery series is a family of highly configurable magnetron sputter deposition systems for thin film coating.

The Gasonics Speed is a chemical vapor deposition (CVD) system manufactured by Lam Research, Novellus, and Gasonics.

The Veeco E 450 is a chemical vapor deposition (CVD) system.

CHA SEC 1000 RAP Vacuum is a vacuum evaporation system in the deposition category.

The ASM E 2000 Plus EPI Reactor is used for epitaxial silicon deposition.

The AJA ATC 2200 is a UHV sputtering system used for physical vapor deposition of films on substrates.