Applied Materials
Producer SE
The Applied Materials Producer SE is a chemical vapor deposition system for 300mm wafers. The Producer SE is offered in a plasma-enhanced chemical vapor deposition (PECVD) configuration with chambers for APE, TEOS, and BLOK deposition. The Producer SE handles 12-inch (300mm) substrate diameters.[1][2]
What it is
The Applied Materials Producer SE is a chemical vapor deposition system for semiconductor manufacturing.[2][4][9][3]
How it works
General reference — not yet source-verifiedA chemical vapor deposition system forms thin films by introducing reactant gases into a process chamber where they decompose or react at the wafer surface.
A plasma-enhanced chemical vapor deposition system uses a plasma to assist film formation at the wafer surface.
Where it fits in the process flow
General reference — not yet source-verifiedThe Producer SE belongs in the thin-film deposition segment of the wafer fabrication flow.
The Producer SE is used after prior surface preparation and before later patterning or integration steps that consume deposited films.
Applications
Why won't it start?
Documented failure modes, common issues, and field considerations.
- missing parts
What do the numbers mean?
Power & electrical6
Wafer handling3
- Kawasaki FI Robot[4]
Gas & chemistry3
- Brooks MFC[4]
Control & software1
- AMAT CH Controller[4]
Configuration & options32
- Chambers:[1]
- A: PECVD APE[1]
- B: PECVD TEOS[1]
- C: PECVD BLOK[1]
- ACL (2CH)[2]
- AMAT Loadport[4]
- AMAT AC&DC Power[4]
- AMAT Chamber[4]
- MKS LFM[4]
- AMAT Faceplate[4]
- AMAT Heater[4]
- AMAT CH AC Box[4]
- AMAT Removte AC Box[4]
- SMC Chiller[4]
- 4 Wire[3]
- with HDD[3]
- missing parts[3]
Vintage & configurations
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Lam Research Concept One 200 PECVD-TEOS— Same function class: Deposition, nullCompare in depthsource[10]
- Lam Research Concept One 200— Same function class: Deposition, nullCompare in depthsource[11]
- Orient Service S 1861 14— Same function class: Deposition, nullCompare in depthsource[12]
- Lam Research Gasonics Vector SOLA— Same function class: Deposition, nullCompare in depthsource[13]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationBrooks MFC[4]
- ConfigurationMKS RPS Generator[4]
- ConfigurationAMAT Ozone Rack with Generator[4]
- Phase3 Phase[3]
- Configuration50/60 Hz[3]
- Process TypePECVD (Plasma-Enhanced Chemical Vapor Deposition)[1]
- Process TypeCVD (Chemical Vapor Deposition)[2]
- Electrical Requirements3 Phase, 4 Wire, 50/60 Hz[3]
- Electrical3 phase, 4 wire, 50/60 Hz[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the main advantage of using a PECVD system over thermal CVD?General reference — not yet source-verified
The primary advantage is that PECVD operates at lower substrate temperatures, enabling film deposition on temperature-sensitive materials and reducing thermal budget for the wafer. The plasma also enhances reaction rates and allows deposition of films with specific stoichiometries and properties that are difficult to achieve with thermal CVD.
What types of films can be deposited with this class of equipment?General reference — not yet source-verified
PECVD systems are versatile and can deposit a variety of dielectric films including silicon dioxide, silicon nitride, silicon oxynitride, amorphous silicon, and doped oxides such as phosphosilicate glass (PSG) or borophosphosilicate glass (BPSG). The exact film composition depends on precursor gases and process conditions.
How is film uniformity controlled in a PECVD system?General reference — not yet source-verified
Film uniformity is controlled through careful design of the gas distribution system (such as a showerhead), plasma uniformity optimization (via electrode design and RF power distribution), and by controlling substrate temperature across the wafer. Real-time monitoring and feedback loops help maintain consistent deposition rates.
What are typical maintenance considerations for PECVD systems?General reference — not yet source-verified
Regular maintenance includes cleaning the chamber to remove deposited films from walls and electrodes, replacing consumable parts such as showerheads and susceptors, calibrating mass flow controllers and temperature sensors, and performing leak checks to maintain vacuum integrity. Particle control is critical to avoid yield loss.
Can PECVD systems be used for processes other than semiconductor IC fabrication?General reference — not yet source-verified
Yes, PECVD technology is also employed in the production of solar cells (for antireflection coatings and passivation layers), flat-panel displays (for thin-film transistors and dielectric layers), and in the coating of optical components and microelectromechanical systems (MEMS) where precise thin-film deposition is required.
Not publicly documented
The following facts about the Producer SE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the Producer SE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Producer SE are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Producer SE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Producer SE are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the Producer SE are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (13)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]Equipment inventory listing
- [3]Equipment inventory listing
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
- [8]Inventory photo
- [9]Equipment inventory listing
- [10]Equipment inventory listing
- [11]Equipment inventory listing
- [12]Equipment inventory listing
- [13]Equipment inventory listing
Last updated Sep 29, 2026.
Compare with similar tools
View all →Lam / Novellus Concept One 200 is a chemical vapor deposition system.
The Lam / Novellus Concept One 200 PECVD-TEOS is a plasma-enhanced chemical vapor deposition tool for tetraethyl orthosilicate processing.
The Lam / Novellus / Gasonics Vector SOLA is a plasma-enhanced chemical vapor deposition (PECVD) system that processes 12-inch wafers and includes a UV cure capability.
Orient Service S 1861 14 is a PECVD (plasma-enhanced chemical vapor deposition) system used with SiO2, HCL, HF, NOx, and NH3.
