Lam Research
Concept One 200 PECVD-TEOS
What it is
General reference — not yet source-verifiedPlasma-enhanced chemical vapor deposition is a thin-film deposition class used to form dielectric and other functional films on wafers. PECVD tools belong in the deposition part of the fab flow and create films by reacting precursor gases in a plasma rather than by purely thermal reaction.
How it works
General reference — not yet source-verifiedA PECVD chamber typically introduces process gases over the wafer, sustains a plasma with applied power, and deposits a thin film on exposed surfaces. The plasma lowers the reaction energy needed for deposition and supports film formation at conditions used for integrated-circuit manufacturing.
Where it fits in the process flow
General reference — not yet source-verifiedThe Concept One 200 PECVD-TEOS sits in the dielectric deposition portion of wafer fabrication. The tool forms insulating films that are used after earlier wafer-patterning steps and before later pattern transfer or interconnect integration steps.
Applications
General reference — not yet source-verifiedPECVD deposition is used for insulating layers, interlayer dielectrics, passivation, and related thin-film applications in semiconductor fabrication. The class is suited to films that must cover patterned topography on processed wafers.
What do the numbers mean?
Power & electrical4
Wafer handling1
Gas & chemistry1
- Process
- PECVD-TEOS (Plasma-Enhanced Chemical Vapor Deposition - Tetraethyl Orthosilicate)[1]
Configuration & options4
- CCP/SiO, SiN[2]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Applied Materials Producer SE— Same function class: Deposition, nullCompare in depthsource[1]
- Applied Materials P 5000 Mark II DLH— Same function class: Deposition, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Concept One 200 PECVD-TEOS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Concept One 200 PECVD-TEOS are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Concept One 200 PECVD-TEOS are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Concept One 200 PECVD-TEOS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Concept One 200 PECVD-TEOS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Concept One 200 PECVD-TEOS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
Last updated Oct 10, 2026.
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