Oxford Instruments
Ion Beam
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Oxford Instruments Ion Beam Deposition System is a deposition tool equipped with DC hot wire filament ion-guns. The Oxford Instruments Ion Beam Deposition System includes a planetary substrate system. The Oxford Instruments Ion Beam Deposition System uses QCM (quartz crystal monitor) for layer thickness measurement.[1]
How it works
Ion beam deposition uses a directed beam of energetic ions to sputter material from a target onto a substrate. The process occurs in a low-pressure vacuum environment, and the beam energy and ion flux can be independently controlled. Substrate temperature can be controlled during deposition, and an etch or pre-clean source allows substrate illumination during the process.[2]
The system produces dense, high-purity films with low porosity and good stoichiometry control. The deposited films exhibit ultra-smooth coating with added film surface roughness on the order of angstroms. The configuration allows precise control of deposited thickness and fine control of film properties.[2]
What do the numbers mean?
Wafer handling2
Configuration & options8
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Brochure_plas_100.pdfDatasheetutah.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
What type of ion guns does the Oxford Ion Beam Deposition System use?
The system uses DC hot wire filament ion guns.[1]
Not publicly documented
The following facts about the Ion Beam are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Ion Beam are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Ion Beam are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Ion Beam are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Ion Beam are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Ion Beam is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Ion beam deposition - Oxford Instruments — plasma.oxinst.complasma.oxinst.com
- [3]Tool List - UCSB Nanofab Wiki — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
- [4]Etching Systems — nanolab.berkeley.edunanolab.berkeley.edu
- [5]Brochure_plas_100.pdf — nanofab.utah.edunanofab.utah.edu
- [6]PECVD System Manual - Maryland University 94-219896 .pdf — nanocenter.umd.edunanocenter.umd.edu
Last updated Sep 23, 2026.
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