Applied Materials
Endura 300
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Applied Materials Endura 300 is a PVD (Physical Vapor Deposition) system. The Endura 300 is configured for 300mm wafers. The Endura 300 platform can be used for processes such as magnetron sputtering of Ni2P thin films.[1][2][3]
What it is
The Applied Materials Endura 300 is a physical vapor deposition (PVD) system designed for semiconductor manufacturing.[1][2]
How it works
The Endura 300 platform can include a magnetron sputtering chamber using radio frequency physical vapor deposition (RF-PVD).[3]
The system allows control of process parameters such as deposition pressure, radio frequency and direct current power, and target-to-wafer spacing.[3]
Where it fits in the process flow
Applications
The platform has been applied in the development of nickel-based contact layers for III-V materials on silicon photonics devices, specifically for sputtering nickel phosphide (Ni2P) films.[3]
What do the numbers mean?
Wafer handling1
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
What wafer sizes does the Endura 300 support?
The Endura 300 is configured to process 300 millimeter wafers.[1][2]
Not publicly documented
The following facts about the Endura 300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Endura 300 are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Endura 300 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Endura 300 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Endura 300 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Endura 300 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]macquarie.com — macquarie.commacquarie.com
- [3]ieeexplore.ieee.org — ieeexplore.ieee.orgieeexplore.ieee.org
- [4]Endura 300 Aluminum Interconnect — Applied Materials | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 26, 2026.
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