CHA
635
The CHA 635 supports both sputtering and evaporation processes. The 635 Series uses a load-locked dome shuttle with a 45-inch source-to-substrate throw, as in the 635/SL variant. The 635/RL robotic load system handles up to 100 x 150mm wafer starts per hour.[1]
What it is
The CHA 635 is a series of modular deposition systems designed for semiconductor and compound semiconductor manufacturing.[2][1]
The system accommodates both sputtering and evaporation processes.[2][1]
The 635 is built on a modular architecture, allowing users to start with a base configuration and later add capacity or capability.[1]
The 635 Series includes three main variants: the 635/SL (single load), the 635/DL (dual load), and the 635/RL (robotic load).[1]
How it works
The 635/SL module uses a load-locked dome shuttle with a source-to-substrate throw distance of 45 inches and a dome size of 37.5 inches.[1]
The 635/SL can manually load up to 25 wafers of 150 mm diameter and return to process pressure in under 5 minutes.[1]
The 635/DL system adds a second load lock, lift-off dome, and dedicated cryopump, enabling simultaneous loading or unloading of one dome while the other is processing.[1]
The 635/RL variant features a Class 10 fully robotic, cassette-to-cassette wafer handling system capable of processing up to 100 wafers of 150 mm per hour.[1]
The 635 Series is offered with both right-hand and left-hand footprints, and can be configured as stand-alone ballroom or flush-mounted cleanroom wall arrangements.[1]
Options include AGV-compatible cassette handling and an enclosed mini-environment.[2][1]
Where it fits in the process flow
The 635 is positioned to serve both semiconductor and compound semiconductor deposition markets, including lift-off processes for evaporative coating and sputter-based coating.[1]
What can it run?
Process applications and technology nodes documented for this tool.
- sputtering
- evaporation
What do the numbers mean?
Wafer handling4
Control & software2
Configuration & options5
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What deposition techniques does the CHA 635 support?
The CHA 635 supports both sputtering and evaporation processes.[2][1]
What variants of the CHA 635 are offered?
The 635 Series includes the 635/SL (single load), 635/DL (dual load), and 635/RL (robotic load) variants.[1]
What is the wafer capacity of the 635/SL?
The 635/SL can manually load up to 25 wafers of 150 mm diameter.[1]
What is the throughput of the 635/RL system?
The 635/RL can process up to 100 wafers of 150 mm per hour.[1]
Not publicly documented
The following facts about the 635 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 635 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 635 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 635 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 635 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 635 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]semiconductoronline.com — semiconductoronline.comsemiconductoronline.com
- [2]web.archive.org — web.archive.orgweb.archive.org
Last updated Sep 22, 2026.
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