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The Varian CC2 is a vacuum gauge controller that is part of the Denton Discovery 18 sputter deposition system.

The Oxford PRS900 is a computer-driven barrel reactor dedicated to dry resist stripping.

The MPI TS150 Probe Station is designed for electrical testing on wafers or chips and supports wafers up to 6 inch.

The AJA ATC 2200 is a UHV sputtering system used for physical vapor deposition of films on substrates.

The Dektak 6M is a stylus profilometer used for film step-height measurement, surface topography profiling, and surface roughness measurement.

The Kulicke & Soffa 782-6 is a dicing saw that handles wafers up to 6 inches and up to 800 µm thick, and dices Si, Glass, Quartz, SiC, Sapphire, and LiNbO3 with kerf widths down to 50 µm.

The Lam AutoEtch 490 is an in-line, cassette to cassette, fully automated, single wafer, double air-locked, parallel plate plasma etching system.

The KLA Flexus F 2320 I is a stress measurement system for semiconductor wafers that supports 6-inch and 8-inch wafers and uses dual wavelength measurement.

The Zeiss SEM Crossbeam 550 is a scanning electron microscope configured at CMi for imaging dedicated to process control and supported with metrology and analysis software.

The Filmetrics F10-RT is an optical spectrometer used for reflectivity measurements.

The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.

The Lam AutoEtch 590 is an in-line cassette to cassette, fully automated, single wafer, double air-locked, parallel plate plasma etching system.

The Karl Suss SB8 Wafer Bonder supports silicon fusion, anodic, and eutectic bonding.

Nikon NSR 2205 i 8 A i-Line Stepper is a 6-inch wafer lithography stepper with a listed 0.5 µm resolution.

The Signatone S-460 is a 6-inch semi-automatic probe station with automated wafer stepping, motorized theta, and a quick two-point align feature.

The OAI 806 Mask Aligner is a precision photolithography tool for patterning substrates up to 6 inches with soft, hard, and proximity contact modes.

The MPI TS150 Probe Station is an electrical test probe station for wafers or chips, using MPI PM100 true X,Y,Z micro-positioners for probe mounting.

The SCREEN / DNS SU 2000 is a single-wafer wet etch tool available in both acid and solvent configurations, supporting 6-inch and 8-inch wafers.

Heidelberg Instruments DWL66 is a high-resolution direct write pattern generator for direct writing on various substrates and mask making.

Raith EBPG5200 is a direct write electron beam lithography system with high-kV capability and automation features stated in the product page for the EBPG line.