Waferpedia

YES

PBX4-300

Thermal / Diffusion300mmYES PBX4-300 family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The YES PBX4-300 is a fully automated thermal processing system from Yield Engineering Systems. The YES PBX4-300 performs polyimide anneal, BCB anneal, copper anneal, and vacuum bake operations. The YES PBX4-300 handles 300mm and 200mm wafers.[1][2]

PBX4-300 — web.archive.org
Fig. 01PBX4-300web.archive.org[1]

What it is

The YES PBX4-300 is a model within the Fully Automated 300mm and 200mm Polyimide/BCB/Copper Anneal/Vacuum Bake System product line manufactured by Yield Engineering Systems.[1][2][3]

Where it fits in the process flow

General reference — not yet source-verified

The YES PBX4-300 is used in back-end-of-line (BEOL) and advanced packaging flows. Polyimide and BCB anneal steps occur after spin-coating of these polymer dielectrics, typically following metal deposition or as part of redistribution layer (RDL) formation. Copper anneal is performed after copper electroplating to relieve stress and reduce resistivity. Vacuum bake is applied before or after other processes to ensure low moisture content and improve adhesion. The machine sits between coating or plating tools and subsequent photolithography or final-test steps.

Applications

General reference — not yet source-verified

Polyimide anneal cures the polymer to achieve its final mechanical and dielectric properties. BCB anneal similarly cures benzocyclobutene, a low-k dielectric used in interlayer insulation and passivation. Copper anneal reduces film stress and grain growth in plated copper lines. Vacuum bake removes moisture and volatile residues from wafers, improving process consistency and preventing outgassing in subsequent vacuum processes.

  • Polyimide anneal
  • BCB anneal
  • Copper anneal
  • Vacuum bake

What do the numbers mean?

Vacuum & pumping2

Product line
Fully Automated 300mm and 200mm Polyimide/BCB/Copper Anneal/Vacuum Bake System[1]2 sources
Accurate?
System type
Fully automated polyimide/BCB/copper anneal and vacuum bake system[1]2 sources
Accurate?

Wafer handling1

Wafer size compatible
300mm and 200mm[1]
Accurate?

Configuration & options3

Model
YES-PBX4-300[1]
Accurate?
Category
Thermal / Diffusion[2]
Accurate?
Product family
YES PBX4-300[3]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
YES-PBX4-300———web.archive.org[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Product lineFully Automated 300mm and 200mm Polyimide/BCB/Copper Anneal/Vacuum Bake System[1]
  • System typeFully automated polyimide/BCB/copper anneal and vacuum bake system[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the PBX4-300 support?

The PBX4-300 supports 300mm and 200mm wafers.[1][2][3]

What is the system type of the PBX4-300?

The PBX4-300 is a fully automated polyimide/BCB/copper anneal and vacuum bake system.[1][2][3]

Who manufactures the PBX4-300?

The PBX4-300 is manufactured by Yield Engineering Systems.[1][2][3]

Is the PBX4-300 automated?

Yes, the PBX4-300 is a fully automated system.[1][2][3]

Not publicly documented

The following facts about the PBX4-300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PBX4-300 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the PBX4-300 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the PBX4-300 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the PBX4-300 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the PBX4-300 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 11, 2026.

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