YES
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The YES PBX4-300 is a fully automated thermal processing system from Yield Engineering Systems. The YES PBX4-300 performs polyimide anneal, BCB anneal, copper anneal, and vacuum bake operations. The YES PBX4-300 handles 300mm and 200mm wafers.[1][2]

The YES PBX4-300 is used in back-end-of-line (BEOL) and advanced packaging flows. Polyimide and BCB anneal steps occur after spin-coating of these polymer dielectrics, typically following metal deposition or as part of redistribution layer (RDL) formation. Copper anneal is performed after copper electroplating to relieve stress and reduce resistivity. Vacuum bake is applied before or after other processes to ensure low moisture content and improve adhesion. The machine sits between coating or plating tools and subsequent photolithography or final-test steps.
Polyimide anneal cures the polymer to achieve its final mechanical and dielectric properties. BCB anneal similarly cures benzocyclobutene, a low-k dielectric used in interlayer insulation and passivation. Copper anneal reduces film stress and grain growth in plated copper lines. Vacuum bake removes moisture and volatile residues from wafers, improving process consistency and preventing outgassing in subsequent vacuum processes.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| YES-PBX4-300 | — | — | — | web.archive.org[1] |
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The following facts about the PBX4-300 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PBX4-300 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the PBX4-300 are not on record.
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No publicly documented failure modes or field errata for the PBX4-300 are on record.
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The process node or technology generation of the PBX4-300 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 11, 2026.
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