Comparison ledger
SUSS MicroTec ACS 300 Gen 2, YES PBX4-300, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ACS 300 Gen 2SUSS MicroTec | PBX4-300YES |
|---|---|---|
| OEM | SUSS MicroTec | YES |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec ACS 300 | YES PBX4-300 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Includes:[2] | — |
| Wafer size | System tooling for 200/300 mm semi spec wafer sizes[2] | — |
| OEM | SUSS MicroTec[3] | — |
| Model | ACS 300 Gen 2[4] | YES-PBX4-300[1] |
| Equipment type | Coater / Developer[2] | — |
| Automation | fully automatic[3] | — |
| Architecture | modular[3] | — |
| Process modes | spin-coating and spray-coating[3] | — |
| Integrated functions | coat, bake, and develop modules[2] | — |
| Product line | — | Fully Automated 300mm and 200mm Polyimide/BCB/Copper Anneal/Vacuum Bake System[1] |
| System type | — | Fully automated polyimide/BCB/copper anneal and vacuum bake system[1] |
| Wafer size compatible | — | 300mm and 200mm[1] |
| Category | — | Thermal / Diffusion[5] |
| Product family | — | YES PBX4-300[6] |
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