West Bond
4 KEX
The West Bond 4 KEX is a wire bonder for packaging and bonding. The West Bond 4 KEX has a 20" × 20" work platform and a 6" × 8" heated work holder. The West Bond 4 KEX has a bond force range of 10–150 grams.[1][2]
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding is a backend semiconductor assembly step that follows device fabrication and die placement.
Wire bonding connects the die or component to the package structure before later assembly and test stages.
Applications
General reference — not yet source-verifiedWire bonders are used in semiconductor packaging to make electrical interconnects for assembled devices.
Wire bonding is used in packaging workflows that require fine-pitch connections between a device and its package or substrate.
What do the numbers mean?
Power & electrical1
Configuration & options7
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage115V, 50/60Hz, 3.2A[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 4 KEX are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4 KEX are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 4 KEX are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 4 KEX are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 4 KEX are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 4 KEX is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]4 KEX — West Bond | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 4, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
