Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, West Bond 4 KEX, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | 4 KEXWest Bond |
|---|---|---|
| OEM | Logitech | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | West Bond 4 KEX |
| Specifications | ||
| Wafer Size | 6 inch[1] | — |
| Configuration | — | 20" × 20" work platform[2] |
| Bond force range | — | 10 – 150 grams[2] |
| Voltage | — | 115V, 50/60Hz, 3.2A[2] |
| Work platform size | — | 20" × 20"[2] |
| Heated work holder size | — | 6" × 8"[2] |
| Wire feed type | — | Conventional 45°[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →