Panasonic
FCX 501 Flip Chip
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Panasonic FCX 501 Flip Chip is a thermosonic flip chip bonder dedicated to ultrasonic and thermosonic flip chip bonding processes (GGI, MDB). The Panasonic FCX 501 is capable of 3,600 UPH including bond time, with accuracy of ±10 microns. The Panasonic FCX 501 is suited to the mass production of compact high-frequency electronic devices.[1]
What it is
How it works
Where it fits in the process flow
The FCX 501 is intended for mass production of compact high-frequency electronic devices.[1]
Applications
What do the numbers mean?
Power & electrical1
Wafer handling2
Performance2
Configuration & options6
- Bond profiles
- Up to ten-step bond profiles with digitally controlled force and ultrasonic power[1]2 sources
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Bond typeMonometallic bond with high thermal and electrical conductivity[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bonding processes does the Panasonic FCX 501 use?
The Panasonic FCX 501 uses ultrasonic and thermosonic flip chip bonding processes for GGI and MDB bonds.[3][1]
What is the throughput of the Panasonic FCX 501?
The Panasonic FCX 501 is capable of 3,600 UPH including bond time.[3][1]
Not publicly documented
The following facts about the FCX 501 Flip Chip are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FCX 501 Flip Chip are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FCX 501 Flip Chip are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FCX 501 Flip Chip are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FCX 501 Flip Chip are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FCX 501 Flip Chip is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]generalmanual.com — generalmanual.comgeneralmanual.com
- [2]Inventory photo
- [3]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 7, 2026.
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