Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Panasonic FCX 501 Flip Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | FCX 501 Flip ChipPanasonic |
|---|---|---|
| OEM | Applied Materials | Panasonic |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Panasonic FCX 501 Flip Chip |
| Specifications | ||
| Bonding processes | — | Ultrasonic and thermosonic flip chip bonding (GGI, MDB)[1] |
| Bond type | — | Monometallic bond with high thermal and electrical conductivity[1] |
| Throughput | — | 3,600 UPH including bond time[1] |
| Accuracy | — | ±10 microns[1] |
| Bonder type | — | Thermosonic bonder[1] |
| Bond profiles | — | Up to ten-step bond profiles with digitally controlled force and ultrasonic power[1] |
| Wafer handling | — | Dual wafer option and automatic wafer feed[1] |
| Footprint | — | 1 meter x 1 meter including loader/unloader[1] |
| Vision system | — | Automatic vision recognition for precise die pick-up and bonding[1] |
| Unit vintage (per listing) | — | 2010, 2011[2] |
| Vintage (per listing) | — | 2010, 2011[3] |
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