Kulicke & Soffa
8060 Wedge
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Kulicke & Soffa 8060 Wedge is a packaging and bonding machine. The Kulicke & Soffa 8060 Wedge is an automatic gold and aluminum wedge bonder. The Kulicke & Soffa 8060 Wedge has a wafer size of 200 mm.[1][2]
What it is
The Kulicke & Soffa 8060 Wedge is a packaging and bonding machine.[1]
How it works
General reference — not yet source-verifiedA wedge bonder makes electrical and mechanical connections by pressing a wedge bonding tool against a bond pad and a bond wire or ribbon. The class is used to place a bond at a precise point and form a joined connection under controlled force and motion.
Where it fits in the process flow
Applications
The Kulicke & Soffa 8060 is used in semiconductor packaging and bonding.[1]
What do the numbers mean?
Wafer handling1
Control & software1
Configuration & options10
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of wire can be used with wedge bonders?General reference — not yet source-verified
Wedge bonders are typically used with aluminum or gold wire, and can also handle copper wire with appropriate process parameters. The wire diameter is chosen based on package requirements, but specific values depend on the machine configuration.
What is the typical bond quality inspection after wedge bonding?General reference — not yet source-verified
Bond quality is assessed through visual inspection, pull testing, and shear testing. Wedge bonders often include real-time monitoring systems that track bonding force, ultrasonic amplitude, and time to ensure consistent quality. Post-bond inspection may also involve automated optical inspection for alignment and loop shape.
How does wedge bonding differ from ball bonding?General reference — not yet source-verified
In wedge bonding, the first bond is wedge-shaped and the second bond is crescent-shaped, using a straight wire feed that can bond in any direction. Ball bonding forms a spherical ball on the first bond and a crescent on the second, requiring rotation for directional changes. Wedge bonding typically uses aluminum wire and is preferred for power devices, while ball bonding is more common for gold wire and fine-pitch packaging.
What are common maintenance requirements for wedge bonders?General reference — not yet source-verified
Regular maintenance includes cleaning or replacing the wedge tool, inspecting wire feed mechanisms, calibrating bond head force and ultrasonic transducers, and checking pattern recognition optics. Preventative maintenance schedules depend on usage and manufacturer recommendations, but class-level best practices emphasize periodic verification of bond parameters.
Can wedge bonders handle multiple package types on the same machine?General reference — not yet source-verified
Yes, wedge bonders are generally designed to be programmable and adaptable to various package formats, including leadframes, substrates, and ceramic packages. Machine software allows for different bond recipes, but specific capabilities depend on the model and configuration.
Not publicly documented
The following facts about the 8060 Wedge are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the 8060 Wedge are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 8060 Wedge are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 8060 Wedge are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 8060 Wedge is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 8060 Wedge are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]waferpedia.com — waferpedia.comwaferpedia.com
- [2]fabsurplus.com — fabsurplus.comfabsurplus.com
- [3]lislesurplus.com — lislesurplus.comlislesurplus.com
- [4]Equipment inventory listing
Last updated Oct 6, 2026.
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