Waferpedia

Comparison ledger

8060 Wedgeversus10490

Kulicke & Soffa 8060 Wedge, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
8060 WedgeKulicke & Soffa
10490West Bond
OEMKulicke & SoffaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones1999 Vintage year of known unit · 2000 Vintage date of known unit—
Control system——
Generation——
FamilyKulicke & Soffa 8060 WedgeWest Bond 10490
Specifications
Bonding TypeWedge[1]—
Automation LevelAutomatic[2]—
Wire MaterialsGold, Aluminum[2]—
Wafer Size200 mm[2]—
ManufacturerKulicke & Soffa[1]West Bond[5]
Model8060 Wedge[3]10490[5]
CategoryPackaging & Bonding[1]—
Machine typePackaging and bonding machine[1]—
Bonder typeAutomatic gold and aluminum wedge bonder[2]—
Vintage year1999[4]—
Vintage date2000-09-01[2]—
Software VersionP805747[4]—
Description—Convertible bonder, wedge to ball[6]
Tool type—Convertible bonder[7]
Bonding modes—Wedge bonding and ball bonding[7]
Use—Wire bonding[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]Equipment inventory listing
  4. [4]lislesurplus.comlislesurplus.com
  5. [5]Equipment inventory listing
  6. [6]fabsurplus.comfabsurplus.com
  7. [7]waferpedia.comwaferpedia.com