Esec

2100 HS

Research Quality: 50% complete

The Esec 2100 HS is a die bonder. The Esec 2100 HS supports epoxy die attach applications. The Esec 2100 HS is specified for wafer sizes from 4 inch to 12 inch on 8 inch or 12 inch wafer frames.^[1]

2100 HS — Inventory photo — Fig. 012100 HSInventory photo^[2]

Wafer size

Power

208 - 230 VAC (@ 47 - 63 Hz), 800 - 1100VA^[6]

Vacuum

Single time pressure dispense system^[3]

Performance

20 µm^[6]

What it is

General reference — not yet source-verified

The Esec 2100 HS is a die bonder used in semiconductor assembly and packaging.

How it works

The Esec 2100 HS uses epoxy die attach and supports wafer, strip, and magazine handling configurations.^[1]^[7]

Where it fits in the process flow

General reference — not yet source-verified

The Esec 2100 HS sits in back-end assembly after wafer fabrication and before later packaging or molding operations.

Applications

The Esec 2100 HS is used for epoxy die attach applications.^[1]

What do the numbers mean?

Power & electrical1

Power supply: 208 - 230 VAC (@ 47 - 63 Hz), 800 - 1100VA^[6]

Vacuum & pumping1

Single time pressure dispense system^[3]

Accurate?

Wafer handling4

Wafer size: 8" wafer ring loader^[3]
Wafer size: 8 inch^[3]
Wafer handling: 8" wafer ring loader^[5]
Wafer size: 4" to 12" (on 8" or 12" wafer frames)^[1]

Performance2

X Y placement accuracy: 20 µm^[6]
Bonding accuracy: 20 µm @ 3σ (15 µm option)^[1]

Dimensions & facilities4

Overall dimensions: 1785 x 1448 x 1400 mm^[6]
Net weight: 1400 kg^[6]
Leadframe size: Length: 90 to 300 mm; Width: 23 to 100 mm^[1]
Machine dimensions: 1785 x 1448 x 1400 mm (W x D x H)^[1]

Configuration & options12

208-240 Vac^[2]; 1 / N / PE^[2]
Power: 2.3 kVA^[2]
Tool type: Die bonder^[2]
Power: 208-240 Vac, 1 / N / PE, 2.3 kVA^[2]
Bond force: 0.2 to 20 N^[6]
Placement speed: Up to 18500 UPH^[6]
Mean time between failure: > 200 h^[6]
Machine type: Die bonder^[1]
Process: Epoxy die attach applications^[1]
Bonding method: Epoxy^[1]
Cycle time: 120 ms with Liquid Cooling option^[1]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
Esec 2100 hS iXplus	—	—	Latest innovation in the Esec Die Bonder 2100 i-family with continuous epoxy pattern writing technology, AI assisted vision inspection, and scalable 2100 i-family features.	besi.com^[7]
Esec 2100 sD advanced i	—	—	Listed by Besi as a related die bonding model.	besi.com^[1]
Esec 2100 hS i	—	—	Listed by Besi as a related die bonding model.	besi.com^[1]
Esec 2100 SC Strip Mapping E142 on Esec Die Bonder	—	—	Listed by Besi as a related die bonding model.	besi.com^[1]
Esec 2100 SSI E	—	—	Listed by Besi as a related die bonding model.	besi.com^[1]
Esec 2009 SSI E	—	—	Listed by Besi as a related die bonding model.	besi.com^[1]
Esec 2009 fS E	—	—	Listed by Besi as a related die bonding model.	besi.com^[1]
Esec 2100 FC hS	—	—	Listed by Besi as a related die bonding model.	besi.com^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

ConfigurationSingle time pressure dispense system^[3]
Power supply208 - 230 VAC (@ 47 - 63 Hz), 800 - 1100VA^[6]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What bonding method does the Esec 2100 HS use?

The Esec 2100 HS uses an epoxy bonding method.^[1]

What wafer sizes can the Esec 2100 HS handle?

The Esec 2100 HS supports wafer sizes from 4 inch to 12 inch on 8 inch or 12 inch wafer frames.^[1]

Not publicly documented

The following facts about the 2100 HS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 HS are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2100 HS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2100 HS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2100 HS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2100 HS are on record.
Answerable by: an OEM parts catalog or a service engineer