Comparison ledger
Esec 2100 HS, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2100 HSEsec | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Esec | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 8" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Esec 2100 | Logitech 1 WBS 1 Wafer Substrate |
| Cited variants | — | |
| Specifications | ||
| Configuration | 208-240 Vac[3] | — |
| Power | 2.3 kVA[3] | — |
| Wafer size | 8" wafer ring loader[4] | — |
| Tool type | Die bonder[3] | — |
| Wafer handling | 8" wafer ring loader[5] | — |
| Power supply | 208 - 230 VAC (@ 47 - 63 Hz), 800 - 1100VA[6] | — |
| Bond force | 0.2 to 20 N[6] | — |
| Placement speed | Up to 18500 UPH[6] | — |
| X Y placement accuracy | 20 µm[6] | — |
| Overall dimensions | 1785 x 1448 x 1400 mm[6] | — |
| Net weight | 1400 kg[6] | — |
| Mean time between failure | > 200 h[6] | — |
| Machine type | Die bonder[2] | — |
| Process | Epoxy die attach applications[2] | — |
| Bonding method | Epoxy[2] | — |
| Bonding accuracy | 20 µm @ 3σ (15 µm option)[2] | — |
| Cycle time | 120 ms with Liquid Cooling option[2] | — |
| Leadframe size | Length: 90 to 300 mm; Width: 23 to 100 mm[2] | — |
| Machine dimensions | 1785 x 1448 x 1400 mm (W x D x H)[2] | — |
| Wafer Size | — | 6 inch[7] |
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