Esec 2100

Models in this family

1. 2100

   The Esec 2100 is a packaging and bonding tool family with die bonder variants, including flip chip, epoxy die attach, and soft solder configurations.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Esec 2100 FC	—	—	Flip chip bonder.	waferpedia.com[1]
   Esec 2100 hS	3rd generation	—	300 mm high speed platform for epoxy die attach applications.	besi.com[2]
   Esec 2100 SSI	—	—	12-inch die bonder with a Soft Solder Indexer and support for soft solder, high force diffusion, and direct sintering processes.	besi.com[3]

2. 

   2100 FC Flip Chip

   The Esec 2100 FC is a flip chip bonder.

3. 

   2100 HS

   The Esec 2100 HS is a die bonder for epoxy die attach applications.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Esec 2100 hS iXplus	—	—	Latest innovation in the Esec Die Bonder 2100 i-family with continuous epoxy pattern writing technology, AI assisted vision inspection, and scalable 2100 i-family features.	besi.com[4]
   Esec 2100 sD advanced i	—	—	Listed by Besi as a related die bonding model.	besi.com[2]
   Esec 2100 hS i	—	—	Listed by Besi as a related die bonding model.	besi.com[2]
   Esec 2100 SC Strip Mapping E142 on Esec Die Bonder	—	—	Listed by Besi as a related die bonding model.	besi.com[2]
   Esec 2100 SSI E	—	—	Listed by Besi as a related die bonding model.	besi.com[2]
   Esec 2009 SSI E	—	—	Listed by Besi as a related die bonding model.	besi.com[2]
   Esec 2009 fS E	—	—	Listed by Besi as a related die bonding model.	besi.com[2]
   Esec 2100 FC hS	—	—	Listed by Besi as a related die bonding model.	besi.com[2]

4. 

   2100 XPproduced 2008–

   The Esec 2100 XP is a die bonder rated at 240 V, 50/60 Hz, single phase, with a full load power of 2300 VA.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   2100 xP	—	—	Described as Esec’s latest die attach platform; presented as a revolutionary die bonder.	web.archive.org[5]
   2100 xP plus	2nd generation of the most flexible 300 mm high speed platform	—	Capable of running the full range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA.	micro-power.com.hk[6]

Sources