ASM
iHawk
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedWire bonders such as the iHawk use a capillary tool to feed a fine bonding wire, typically gold, through its tip to create electrical connections between a semiconductor die and its package leads.
The machine forms a ball at the end of the wire using an electrical discharge, then presses that ball onto a heated bonding pad on the chip to make a first bond, a process called ball bonding.
Where it fits in the process flow
General reference — not yet source-verifiedThe iHawk wire bonder is used in the back-end semiconductor assembly process, after wafer dicing and die attach, and before encapsulation or molding of the packaged device.
The equipment typically follows die bonding and precedes final encapsulation, testing, and singulation steps in the packaging workflow.
Applications
General reference — not yet source-verifiedThe ASM iHawk is used to create wire bonds for interconnecting integrated circuit chips to package leads in a variety of package types.
Wire bonders are commonly employed in packaging processes for memory, logic, and power devices, as well as for discrete semiconductors and sensors.
What do the numbers mean?
Configuration & options5
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the iHawk are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the iHawk are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the iHawk are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the iHawk are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the iHawk are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the iHawk is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Equipment inventory listing
Last updated Oct 1, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
