Waferpedia

Tool family

ASM iHawk

Models in this family

  1. ASM iHawk Aeropanel is a wire bonder described with 220 V, 50/60 Hz, and 1.5 KVA power specifications.

  2. The ASM iHawk Xtreme is an automatic wire bonder used in semiconductor packaging, supporting gold, copper, and alloy wires with capabilities including ultra-low loop control and automatic wire rethreading.

    Cited variants

    DesignationGenerationVintageChangesSource
    iHawk Xtreme GoCu——Identified as a variant used for copper wire bondingpatents.google.com[1]

All entries

  1. iHawkASM
    CategoryPackaging & Bonding
    5 specs
  2. iHawk AeropanelASM

    ASM iHawk Aeropanel is a wire bonder described with 220 V, 50/60 Hz, and 1.5 KVA power specifications.

    CategoryPackaging & Bonding
    5 specs
  3. iHawk XtremeASM

    The ASM iHawk Xtreme is an automatic wire bonder used in semiconductor packaging, supporting gold, copper, and alloy wires with capabilities including ultra-low loop control and automatic wire rethreading.

    CategoryPackaging & Bonding
    32 specs

Sources

Sources (1)Every fact above is drawn from these public sources
  1. [1]patents.google.compatents.google.com