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Applied Materials

Mirra Mesa

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Applied Materials Mirra Mesa is a CMP (Chemical Mechanical Polisher). Applied Materials Mirra Mesa has a 4-head, 3-platen polisher system module. Applied Materials Mirra Mesa includes OX process configuration.[1][2]

Mirra Mesa — Inventory photo
Fig. 01Mirra MesaInventory photo[3]

Power

50/60 HZ; 200-230V; three-phase four-wire[1]

Vacuum

Peristaltic pump[1]

Gas delivery

Standard tunable[1]

Optics

Smoke Detector[1]

What it is

Applied Materials Mirra Mesa is a chemical mechanical polisher used for chemical mechanical planarization.[1][5][2]

The Mirra Mesa uses a four-head, three-platen polisher system module.[5][2][1]

How it works

The Mirra Mesa has three platens, and each platen is configured with a windowed belt-and-gear CVT drive.[1][2]

The Mirra Mesa uses standard tunable slurry arms on all three platens and a three-zone polishing head.[1][2]

Where it fits in the process flow

General reference — not yet source-verified

A chemical mechanical polisher sits in the wafer planarization stage of semiconductor fabrication, where it smooths and levels surfaces before later process steps continue.

Applications

The Mirra Mesa is used for oxide CMP.[5][1][2]

The Mirra Mesa supports slurry delivery with two types of slurry and peristaltic pump flow control.[1][2]

What do the numbers mean?

Power & electrical3

Electrical requirements
50/60 HZ; 200-230V; three-phase four-wire[1]
Accurate?
Line Frequency
50/60 HZ[1]
Accurate?
Line voltage
200-230V[1]
Accurate?

Vacuum & pumping1

Slurry flow rate control
Peristaltic pump[1]
Accurate?

Wafer handling1

Cleaner robot
working beam Megasonics Module[1]
Accurate?

Gas & chemistry5

Platen 1 slurry arm
Standard tunable[1]
Accurate?
Platen 2 slurry arm
Standard tunable[1]
Accurate?
Platen 3 slurry arm
Standard tunable[1]
Accurate?
Slurry Delivery
2 types of slurry[1]
Accurate?
Category
CMP (Chemical Mechanical Polisher)[1]
Accurate?

Optics & imaging1

Facilities option
Smoke Detector[1]
Accurate?

Dimensions & facilities1

Facilities option
EMO Guard Ring[1]
Accurate?

Configuration & options32

CMP Model
Mirra Mesa[1]
Accurate?
Process
OX[1]
Accurate?
Polisher System Module
4 Head 3 Platen[1]
Accurate?
Platen 1 configuration:[1]
Accurate?
Platen 1 Type
With window, belt + gear CVT[1]
Accurate?
Platen 1 endpoint
Full scan and motor torque[1]
Accurate?
Platen 1 pad conditioner arm
Standard[1]
Accurate?
Platen 2 configuration:[1]
Accurate?
Platen 2 Type
With window, belt + gear CVT[1]
Accurate?
Platen 2 endpoint
Full scan[1]
Accurate?
Platen 2 pad conditioner arm
Standard[1]
Accurate?
Platen 3 configuration:[1]
Accurate?
Platen 3 Type
With window, belt + gear CVT[1]
Accurate?
Platen 3 endpoint
Full scan[1]
Accurate?
Platen 3 pad conditioner arm
Standard[1]
Accurate?
Polishing head
3 zone[1]
Accurate?
Model
Mirra Mesa[1]
Accurate?
FABs port
3 Port[1]
Accurate?
Cleaner quantity
1 unit[1]
Accurate?
Cleaning method
Vertical[1]
Accurate?
Megasonics delivery type
2 Chem flow meter type[1]
Accurate?
Brush 1 clean
1 Chem and DIW[1]
Accurate?
Brush 1 flow type
flow meter type[1]
Accurate?
Brush 2 clean
1 Chem and DIW[1]
Accurate?
Brush 2 flow rate
flow meter type[1]
Accurate?
Dry type
Spin Dryer[1]
Accurate?
Drying
Lamp heater Drying; N2 Drying[1]
Accurate?
OEM
Applied Materials[1]
Accurate?
Connection
Three-phase four-wire[1]
Accurate?
Power lamp
Green Lamp[1]
Accurate?
Power connected lamp
Power Connected Lamp[1]
Accurate?
GFI type
STANDARD 30mA[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
Mirra Mesa CMP 5201——CMP polisher for 8-inch wafers with oxide, dry-in/dry-out configuration.waferpedia.com[5]
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Platen 1 slurry armStandard tunable[1]
  • Platen 2 slurry armStandard tunable[1]
  • Platen 3 slurry armStandard tunable[1]
  • Slurry Delivery2 types of slurry[1]
  • CategoryCMP (Chemical Mechanical Polisher)[1]
  • Slurry flow rate controlPeristaltic pump[1]
  • Electrical requirements50/60 HZ; 200-230V; three-phase four-wire[1]
  • Line Frequency50/60 HZ[1]
  • Line voltage200-230V[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What are the main consumables for a CMP machine of this class?General reference — not yet source-verified

The primary consumables are polishing pads (which require periodic conditioning and replacement), slurry chemicals (often a mixture of abrasive particles and reactive agents), and carrier head parts such as retaining rings and membranes. Pad conditioners and filter elements are also regularly replaced.

How does endpoint detection work in typical CMP systems?General reference — not yet source-verified

Endpoint detection commonly uses optical interferometry (monitoring reflectivity of the wafer surface), friction-based methods (monitoring motor current or torque), or direct measurement of removal rate via a built-in sensor. The goal is to stop polishing when the target thickness is reached, preventing over-polish and dishing.

What are the common defects associated with CMP processes?General reference — not yet source-verified

Common defects include micro-scratches caused by agglomerated slurry particles, dishing (concave shape in metal features due to differential polish rates), erosion (thinning of dielectric around dense metal lines), and embedded particles. Post-CMP cleaning steps are critical to remove slurry residues and prevent contamination.

How important is pad conditioning for process stability?General reference — not yet source-verified

Pad conditioning is essential to maintain consistent removal rates and uniformity. As pads wear, their surface porosity decreases, reducing slurry transport and altering pressure distribution. A diamond conditioner is typically used to abrade the pad surface, restoring its roughness and exposure of fresh pad material. Conditioning must be carefully controlled via downforce, sweep pattern, and frequency.

Not publicly documented

The following facts about the Mirra Mesa are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Mirra Mesa are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Mirra Mesa are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Mirra Mesa are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Mirra Mesa is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Mirra Mesa are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (11)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Mirra Mesa — Applied Materials | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
  3. [3]Inventory photo
  4. [4]Inventory photo
  5. [5]waferpedia.com — waferpedia.comwaferpedia.com
  6. [6]Equipment inventory listing
  7. [7]libertymachinery.comlibertymachinery.com
  8. [8]Equipment inventory listing
  9. [9]waferpedia.comwaferpedia.com
  10. [10]waferpedia.comwaferpedia.com
  11. [11]waferpedia.comwaferpedia.com
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Last updated Oct 5, 2026.

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