Nova
V 2600
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Nova V 2600 is a CMP (Chemical Mechanical Polisher) for 12-inch wafers. The Nova V 2600 includes an integrated CMP Endpoint / Film Measurement system.[1][2]
What it is
How it works
General reference — not yet source-verifiedThe V 2600 performs chemical mechanical polishing, a process that combines chemical etching with mechanical abrasion to planarize wafer surfaces.
The V 2600 integrates endpoint detection and film measurement, which allows the system to monitor the polishing process and determine when the target thickness or planarity is achieved.
Where it fits in the process flow
General reference — not yet source-verifiedThe V 2600 sits in the front-end of line portion of semiconductor fabrication, where it is used to planarize dielectric and metal layers on the wafer surface.
CMP is typically performed after deposition steps, such as chemical vapor deposition or electroplating, to remove excess material and create a flat surface for subsequent lithography or etch steps.
Applications
General reference — not yet source-verifiedThe V 2600 is used for planarization of interlayer dielectrics, shallow trench isolation, and metal interconnects in integrated circuit manufacturing.
The V 2600 supports applications requiring precise thickness control and surface uniformity, which are critical for advanced device layers.
What do the numbers mean?
Wafer handling1
Configuration & options3
- Integrated CMP Endpoint / Film Measurement[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- SCREEN AS 2000— Same function class: CMP, nullCompare in depthsource[2]
- Applied Materials Mirra Mesa— Same function class: CMP, nullCompare in depthsource[2]
- Applied Materials Mirra 3400— Same function class: CMP, nullCompare in depthsource[2]
- Applied Materials Reflexion 3600— Same function class: CMP, nullCompare in depthsource[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What kind of tool is the Nova V 2600?
The Nova V 2600 is a chemical mechanical polisher.[2]
What wafer size does the Nova V 2600 process?
The Nova V 2600 is designed for 12-inch wafers.[2]
What integrated measurement functions does the Nova V 2600 include?
The Nova V 2600 includes integrated CMP endpoint measurement and film measurement.[2]
What is the main process use of the Nova V 2600?
The Nova V 2600 is used for wafer planarization in integrated circuit manufacturing.[2]
Not publicly documented
The following facts about the V 2600 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the V 2600 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the V 2600 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the V 2600 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the V 2600 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the V 2600 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 10, 2026.
Compare with similar tools
View all →The SCREEN / DNS AS 2000 is a CMP (Chemical Mechanical Polisher) for 8-inch wafers.
The Applied Materials Mirra 3400 is a chemical mechanical planarization (CMP) system for 150 mm and 200 mm wafer processing.
Applied Materials Mirra Mesa is a CMP (Chemical Mechanical Polisher) with a 4-head, 3-platen polisher system module.
The Applied Materials Reflexion 3600 is a CMP (Chemical Mechanical Polisher).
