GigaMat
3806 L
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedCMP combines mechanical abrasion and chemical etching to remove material and produce a flat, planar surface on a semiconductor wafer.
In a typical CMP system, a rotating platen covered with a polishing pad presses against the wafer while a chemically active slurry is dispensed onto the pad.
Where it fits in the process flow
General reference — not yet source-verifiedCMP is performed multiple times during semiconductor fabrication to planarize dielectric and metal layers after deposition and before subsequent lithography or etch steps.
The GigaMat 3806 L is a polisher that would be placed in the CMP module of a wafer fab, between deposition and patterning processes.
Applications
General reference — not yet source-verifiedCMP is used for interconnect planarization in damascene processes, for shallow trench isolation, and for global planarization of interlayer dielectrics.
What do the numbers mean?
Power & electrical2
Configuration & options1
- With Water Jet[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Applied Materials Mirra Mesa— Same function class: CMP, UnknownCompare in depthsource[1]
- Strasbaugh 6 DF DC 1— Same function class: CMP, UnknownCompare in depthsource[1]
- Applied Materials Mirra 3400— Same function class: CMP, UnknownCompare in depthsource[1]
- Applied Materials Reflexion 3600— Same function class: CMP, UnknownCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 3806 L are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3806 L are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3806 L are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3806 L are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3806 L are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3806 L is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]3806 L — GigaMat | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 22, 2026.
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The Strasbaugh 6 DF DC 1 is a refurbished single-station CMP (chemical mechanical polisher) with a 24-inch capacity overarm spindle polisher.
The Applied Materials Mirra 3400 is a chemical mechanical planarization (CMP) system for 150 mm and 200 mm wafer processing.
Applied Materials Mirra Mesa is a CMP (Chemical Mechanical Polisher) with a 4-head, 3-platen polisher system module.
The Applied Materials Reflexion 3600 is a CMP (Chemical Mechanical Polisher).
