West Bond
The West Bond model 7KE is a convertible manual wire bonder. The 7KE interconnects gold wire leads to various semiconductor devices. The 7KE is located in the FabLab Exploratory Lab at the University of Maryland.[1]
The West Bond 7KE is a convertible manual wire bonder used to interconnect gold wire leads to various semiconductor devices.[1]
Wire bonders join fine wire — typically gold or aluminum — between a semiconductor die and its package or substrate using thermocompression, thermosonic, or ultrasonic energy. In manual wire bonders like the 7KE, an operator positions a bonding tool under a microscope and actuates the bond head to create each connection one at a time.
Wire bonding is a final-assembly step in semiconductor packaging, performed after wafer dicing and die attach. The wire bonder connects bond pads on the die to lead fingers or substrate lands, completing the electrical path from the chip to the external package terminals.
The West Bond 7KE is used for interconnecting gold wire leads to semiconductor devices in a laboratory or prototyping environment.[1]
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The West Bond 7KE is a convertible manual wire bonder.[1]
The following facts about the 7KE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7KE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7KE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7KE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7KE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7KE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Oct 4, 2026.
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.