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West Bond

7476B

Packaging & BondingWest Bond 7476B family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The West Bond 7476B is a 90° vertical feed deep access wedge bonder.[1]

West Bond7476B
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What it is

The West Bond 7476B is a 90° vertical feed deep access wedge bonder.[1]

How it works

General reference — not yet source-verified

Wedge wire bonders operate by threading a wire through a ceramic or tungsten-carbide bonding tool (the wedge) and pressing it against the bond pad while applying ultrasonic vibration. The combination of force, ultrasonic energy, and in some cases heat creates a solid-state weld between the wire and the metallized pad. The bonder then moves to the second bond point (typically a package lead or substrate pad), repeats the process, and tears the wire to leave a tail for the next bond.

Where it fits in the process flow

General reference — not yet source-verified

Wire bonding is performed after die attach and cure, when the semiconductor die is already mounted on a lead frame or substrate. The bonder connects the die bond pads to the package leads, completing the electrical path. The next process step is encapsulation or molding, which surrounds the bonded assembly with a protective plastic or ceramic package.

Deep-access wedge bonders such as the 7476B are used when the bond sites are recessed inside a package cavity, for example in hybrid circuits or certain ceramic packages where the die is positioned well below the lead plane.

Applications

General reference — not yet source-verified

The West Bond 7476B is suited for deep-access wedge bonding applications encountered in hybrid microelectronics, multi-chip modules, optoelectronic packages, and other semiconductor assemblies where the bond location is recessed or where a vertical tool approach is required to avoid interfering with adjacent components.

What do the numbers mean?

Configuration & options3

Bonding type
Wedge[1]
Accurate?
Feed angle
90° vertical[1]
Accurate?
Access type
Deep access[1]
Accurate?
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Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the 7476B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7476B are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 7476B are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 7476B are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 7476B are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 7476B is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
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Last updated Oct 3, 2026.

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