West Bond
7374E
The West Bond 7374E is a manual dual-head die bonder. The West Bond 7374E uses gantry construction for unlimited work piece size. The West Bond 7374E includes ESD protection.[1]
What it is
How it works
The West Bond 7374E uses dual heads that alternately pick up chips, rotate them, place them, and bond them.[1]
The West Bond 7374E uses detachable heads for different pickup and bonding methods.[1]
The West Bond 7374E uses an orthogonal three-axis micromanipulator with X, Y, and Z motions arranged above the work plane.[1]
Where it fits in the process flow
General reference — not yet source-verifiedThe West Bond 7374E sits in semiconductor and microelectronics assembly after die preparation and before final package completion.
The West Bond 7374E is used for attaching chips to packages or modules in packaging workflows.
Applications
The West Bond 7374E is used in microelectronics packaging.[1]
- Chip pick-up
- Chip placement
- Chip bonding
What do the numbers mean?
Configuration & options7
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 7374E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7374E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7374E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7374E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7374E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7374E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]cltrep.com — cltrep.comcltrep.com
Last updated Oct 2, 2026.
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