Ulvac
SIV 200 ITO
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Ulvac SIV 200 ITO is a sputtering deposition system. The Ulvac SIV 200 ITO is an in-line vacuum sputtering system that uses single-source reactive magnetron sputtering to deposit oxide films such as ITO. The Ulvac SIV 200 ITO features a 3-station process module (P1, P2, P3) with a 5 kW pulsed DC power supply.[1][2]
What it is
The Ulvac SIV 200 ITO is a sputtering deposition system.[1]
How it works
General reference — not yet source-verifiedThe Ulvac SIV 200 ITO uses sputtering, a physical vapor deposition method that removes material from a target and transfers it to a substrate as a thin film.
Where it fits in the process flow
General reference — not yet source-verifiedThe Ulvac SIV 200 ITO sits in the thin-film deposition segment of the process flow, before downstream patterning, etch, or device assembly steps that use the deposited film.
Applications
The Ulvac SIV 200 ITO is used for indium tin oxide and other transparent conductive film deposition.[2]
What do the numbers mean?
Power & electrical3
- P3 station role
- P3 is dedicated to ITO or other transparent conductive films (TCF); has O₂ MFC and 13.56 MHz power supply/match to maintain ITO stoichiometry[2]
- Sputtering mode
- Single-source reactive magnetron sputtering; a single-source RF magnetron deposits oxide films like ITO and A-Si[2]
Vacuum & pumping2
- Vacuum system
- Load lock has roughing pump and water pump; process chamber has roughing pump T-ed to turbo/water pump and cryo pump auto-load; uses Ulvac 10-inch cryo and 10-inch water pump/turbo[2]
- Optional high-temperature oxidation chamber
- An integrated high-temperature atmospheric-pressure oxidation chamber is available to deposit refractory oxide films with high oxidation rates and film purity[2]
Wafer handling1
- Wafer handling
- Handles (3) 6-inch wafers on a 200 × 200 mm carrier; front-end stocker holds 6 carriers[2]
Optics & imaging1
Configuration & options2
- Depositable materials
- Handles both conductive and insulative films, including high-transparency films for display applications[2]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| SIV-200S | — | — | Allows for simultaneous deposition from up to four targets, enhancing throughput | tarasemi.com[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Power supply5 kW pulsed DC power supply[2]
- P3 station roleP3 is dedicated to ITO or other transparent conductive films (TCF); has O₂ MFC and 13.56 MHz power supply/match to maintain ITO stoichiometry[2]
- Vacuum systemLoad lock has roughing pump and water pump; process chamber has roughing pump T-ed to turbo/water pump and cryo pump auto-load; uses Ulvac 10-inch cryo and 10-inch water pump/turbo[2]
- Sputtering modeSingle-source reactive magnetron sputtering; a single-source RF magnetron deposits oxide films like ITO and A-Si[2]
- Optional high-temperature oxidation chamberAn integrated high-temperature atmospheric-pressure oxidation chamber is available to deposit refractory oxide films with high oxidation rates and film purity[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the machine type?
It is a sputtering deposition system.[3]
Not publicly documented
The following facts about the SIV 200 ITO are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SIV 200 ITO are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the SIV 200 ITO are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SIV 200 ITO are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SIV 200 ITO is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SIV 200 ITO are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]SIV 200 ITO — Ulvac | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [2]tarasemi.com — tarasemi.comtarasemi.com
- [3]Equipment inventory listing
Last updated Oct 3, 2026.
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