UTC 400 BI

The Shinkawa UTC 400 BI is a packaging and bonding tool manufactured by Shinkawa. The system is categorized as a bonder used in semiconductor packaging and bonding applications.^[1][2]

A die bonder typically uses a pick-and-place mechanism to transfer individual dies from a wafer or tape carrier to a bonding site. The placement head may incorporate vision alignment to achieve the required positional accuracy.

Bonding can be performed by dispensing epoxy adhesive, applying a solder preform, or using thermocompression or thermosonic techniques. The tool may include a heated stage and a bond head that applies controlled force and temperature during the attachment cycle.

The UTC 400 BI sits in the back-end of semiconductor manufacturing, after wafer dicing and before wire bonding and encapsulation. The incoming parts are singulated dies and substrates or leadframes; the outgoing product is a bonded assembly ready for electrical interconnection.

Upstream steps include wafer sawing and die inspection. Downstream processes include wire bonding, molding, trim and form, and final test. The die bonder is a critical step for package reliability, as die attach quality directly affects thermal and mechanical performance.

The UTC 400 BI is used for attaching integrated circuits, discrete semiconductors, and sensors to various package types including leadframes, ball grid array substrates, and hybrid circuits.

Typical materials handled include silicon dies, gallium arsenide dies, and other semiconductor devices. The bonder can be configured for different die sizes and substrate formats depending on the production requirements.