Waferpedia

Laurell

WS-650-15

Spin coater300mm650-seriesLaurell WS-650-15 family
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The Laurell WS-650-15 is a station-mounted spin coater. The Laurell WS-650-15 accommodates up to 300mm wafers. The Laurell WS-650-15 features a maximum rotational speed of 12,000 RPM.[1][2][3]

WS-650-15 — web.archive.org
Fig. 01WS-650-15web.archive.org[1]

Wafer size

300mm

Power

95 to 240VAC, 47/63HZ, ~300 Watts[1]

What it is

The Laurell WS-650-15 is a spin coater.[1]

The WS-650-15 belongs to Laurell's 650-series coater systems.[1][2][3]

How it works

The WS-650-15 uses a process controller that can pause, stop, continue, and loop process steps during execution.[1][2][3]

The WS-650-15 uses a closed bowl design, a labyrinth seal, and nitrogen purge to help limit chemical contamination of the motor and electronics.[1][2][3]

Where it fits in the process flow

The WS-650-15 is used for coating and related wet-process steps on substrates before later pattern-transfer or cleaning operations.[1][2][3]

The WS-650-15 supports coating, etching, developing, rinsing-drying, and cleaning in solvent, base, or acid-based processing.[1][2][3]

Applications

The WS-650-15 accommodates wafers up to 300 mm and substrates up to 229 mm by 229 mm.[1][2][3]

The WS-650-15 features a maximum rotational speed of 12,000 RPM based on a 100 mm silicon wafer.[1][2][3]

  • Coating
  • Etching
  • Developing
  • Rinsing-Drying
  • Cleaning
  • Solvent-based processing
  • Base-based processing
  • Acid-based processing

What do the numbers mean?

Power & electrical1

Power
95 to 240VAC, 47/63HZ, ~300 Watts[1]
Accurate?

Wafer handling5

Maximum rotational speed
12,000 RPM (based on a ø 100mm silicon wafer)[1]
Accurate?
Wafer capacity
up to ø 300mm wafers[1]
Accurate?
Substrate capacity
9" × 9" (229mm × 229mm) substrates[1]
Accurate?
Substrate capacity
9 in x 9 in (229mm x 229mm) substrates[1]
Accurate?
Speed basis
Based on a 100mm silicon wafer[1]
Accurate?

Control & software1

Process controller
650-series process controller[1]
Accurate?

Configuration & options4

Model
WS-650-15[1]
Accurate?
Station mounted[1]
Accurate?
Maximum rotational speed
12,000 RPM[1]
Accurate?
Processes supported
Coating, Etching, Developing, Rinsing-Drying and Cleaning[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
WS-650-15 B650-series—Described as the station-mounted WS-650-15 B spin coater.web.archive.org[1]
WS-650-15B650-series—Described as the station-mounted WS-650-15B spin coater.web.archive.org[2]
WS-650-15 B650-series—Described as the station-mounted WS-650-15 B spin coater.web.archive.org[3]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Power95 to 240VAC, 47/63HZ, ~300 Watts[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What determines the final film thickness in spin coating?General reference — not yet source-verified

Film thickness is primarily controlled by the spin speed and spin time, as well as the viscosity and concentration of the coating solution. Higher rotation speeds typically produce thinner films, while longer spin times allow the layer to settle until equilibrium is reached.

How is the substrate secured during spinning?General reference — not yet source-verified

Substrates are commonly held onto the rotor by a vacuum chuck, which draws a low-pressure region through a porous or perforated plate. Some coaters use spring-loaded clamps or magnetic retention for substrates that cannot tolerate vacuum.

What materials can be applied with a spin coater?General reference — not yet source-verified

Spin coaters can handle a wide range of fluid materials, including photoresists, polymers, precursors for sol-gel chemistry, nanoparticle suspensions, and certain colloidal dispersions. The fluid must be sufficiently low in viscosity to flow evenly and must evaporate at a consistent rate during spinning.

Is the process limited by substrate size or shape?General reference — not yet source-verified

Spin coaters are designed for flat, disk-shaped substrates, though alternative fixtures can accommodate square or irregular pieces. The maximum substrate diameter is constrained by the rotor clearance and the ability to maintain uniform centrifugal forces, but sizes vary among models.

Not publicly documented

The following facts about the WS-650-15 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the WS-650-15 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the WS-650-15 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the WS-650-15 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the WS-650-15 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the WS-650-15 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]web.archive.org — web.archive.orgweb.archive.org
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Last updated Oct 5, 2026.

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