Waferpedia

Lam Research

Vector

DepositionLam Research Vector family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

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What it is

The VECTOR product family includes PECVD systems for dielectric film deposition on semiconductor wafers.[2][1]

What do the numbers mean?

Wafer handling1

Wafer size
12 inch[2]
Accurate?

Gas & chemistry1

Process
Plasma-Enhanced Chemical Vapor Deposition (PECVD)[1]
Accurate?

Configuration & options2

Product family
VECTOR Product Family[1]
Accurate?
Architecture
Quad station module (QSM)[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
VECTOR———lamresearch.com[1]
VECTOR TEOS———lamresearch.com[1]
VECTOR AHM———lamresearch.com[1]
VECTOR MD———lamresearch.com[1]
VECTOR Strata———lamresearch.com[1]
VECTOR DT———lamresearch.com[1]
VECTOR TEOS 3D———lamresearch.com[1]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ProcessPlasma-Enhanced Chemical Vapor Deposition (PECVD)[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What are the key advantages of using a PECVD system like the Vector for deposition?General reference — not yet source-verified

The primary advantage is the ability to deposit films at lower temperatures than traditional thermal CVD, which reduces thermal budget and prevents unwanted diffusion or degradation of underlying materials. Additionally, PECVD offers good film uniformity, controllable stress, and high deposition rates suitable for volume manufacturing.

How does the plasma affect film quality compared to thermal processes?General reference — not yet source-verified

The plasma enhances the reaction kinetics, allowing deposition at lower temperatures, but it can also lead to ion bombardment and potential film damage if not carefully controlled. Proper tuning of plasma power, pressure, and gas flows is necessary to achieve dense, low-defect films with desired electrical properties.

Not publicly documented

The following facts about the Vector are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Vector are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the Vector are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Vector are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Vector is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the Vector are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]lamresearch.com — lamresearch.comlamresearch.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
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Last updated Oct 11, 2026.

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