Lam Research
Concept One 150 PECVD-TEOS
The Lam / Novellus Concept One 150 PECVD-TEOS is a plasma-enhanced chemical vapor deposition system. The system processes 6-inch wafers and uses tetraethyl orthosilicate (TEOS) as a precursor for silicon dioxide deposition.[1]
What it is
The Concept One 150 is a plasma-enhanced chemical vapor deposition (PECVD) system manufactured by Lam Research under the Novellus brand.[1]
How it works
General reference — not yet source-verifiedPECVD systems of this class deposit thin films by introducing gaseous precursors into a vacuum chamber, where a plasma enhances the chemical reaction at reduced temperatures.
For TEOS-based deposition, the organosilicon precursor reacts with an oxidizer in the plasma to form a silicon dioxide layer on the wafer surface.
Where it fits in the process flow
General reference — not yet source-verifiedDeposition systems of this type are typically used in the fabrication of integrated circuits to form insulating layers, such as interlayer dielectrics, at a stage after the underlying devices have been patterned.
The deposited film may be subsequently etched or polished to create the desired topography for interconnect structures.
Applications
General reference — not yet source-verifiedA PECVD-TEOS system is used to deposit silicon dioxide films for applications including intermetal dielectric layers, passivation, and gap fill in semiconductor manufacturing.
What do the numbers mean?
Power & electrical2
Wafer handling1
Gas & chemistry1
- Process
- PECVD-TEOS (Plasma-Enhanced Chemical Vapor Deposition - Tetraethyl Orthosilicate)[1]
Configuration & options4
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the Concept One 150 PECVD-TEOS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Concept One 150 PECVD-TEOS are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Concept One 150 PECVD-TEOS are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Concept One 150 PECVD-TEOS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Concept One 150 PECVD-TEOS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Concept One 150 PECVD-TEOS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Oct 4, 2026.
Compare with similar tools
View all →
The Applied Materials 0010-13622 is an RF match unit intended for PVD (Physical Vapor Deposition) described as a High Efficiency HE RF Match-Bias.
The Applied Materials 0020 12458 Part is an insulator, side match component for the Hdp-Cvd Ultima Plus system.
Applied Materials 0020 18455 is a part described as "Shaft, Rf In Local Match, Hdpcvd, Rev3."