EV Group
501 Wafer
Plate 01EVG 501 Wafer Bonder (ID# 4726)
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Wafer size
Manual wafer load substrate bonder
Power
0-2000 V, 0-50 mA[3]
Vacuum
High-vacuum capable bond chamber[2]
Performance
± 1,5 %[2]
What it is
The EVG 501 is a manual-load wafer bonding system from EV Group. The system can handle substrate sizes from single chips to 200 mm. The EVG 501 supports multiple bonding processes including anodic, direct, fusion, glass frit, solder, eutectic, transient liquid phase, and thermal compression bonding.[3][2]
How it works
The EVG 501 has an open chamber design for fast conversion and maintenance. The maximum contact force is up to 20 kN. Top and bottom side heaters can reach up to 450 °C. The standard vacuum capability is 1×10⁻¹ mbar, with an optional high-vacuum version to 1×10⁻⁵ mbar. The system provides an anodic bonding power supply of 0 to 2000 V and 0 to 50 mA. Temperature uniformity is specified as ±1.5 %.[3][2]
Applications
General reference — not yet source-verifiedWafer bonding is used in microelectromechanical systems for device sealing, in three-dimensional integrated circuits for stacking, in wafer-level packaging, and in the production of silicon-on-insulator wafers. Each application requires a specific bonding method, such as anodic, direct, or glass frit bonding.
What do the numbers mean?
Power & electrical1
Vacuum & pumping5
Wafer handling4
Performance1
Control & software3
Dimensions & facilities1
Configuration & options12
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- EVG 501 BrochureDatasheettamu.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 501 Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 501 Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 501 Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 501 Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 501 Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 501 Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
- [3]aggiefab.tamu.edu — aggiefab.tamu.eduaggiefab.tamu.edu
- [4]EVG|Wafer Bonding Systeme — evgroup.com (Mar 12, 2017)web.archive.org
Last updated Oct 1, 2026.
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