EV Group
40 Top-to-Bottom Side Measurement
What it is
How it works
Where it fits in the process flow
The EV Group 40 Top-to-Bottom Side Measurement System supports processes that involve double-sided lithography.[2]
Applications
What do the numbers mean?
Power & electrical3
- 50/60 Hz[1]
Wafer handling2
- Capable of handling up to 8"/200mm substrates / wafers[1]
Performance3
- Manual Alignment Stage[1]
Control & software3
Configuration & options1
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EVG 40NT | — | — | — | web.archive.org[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does the EV Group 40 Top-to-Bottom Side Measurement System measure?
The EV Group 40 Top-to-Bottom Side Measurement System measures alignment accuracy for double-sided lithography.[2]
Does the EV Group 40 Top-to-Bottom Side Measurement System perform destructive testing?
The EV Group 40 Top-to-Bottom Side Measurement System performs destruction-free alignment accuracy measurements.[2]
What substrate sizes can the EV Group 40 Top-to-Bottom Side Measurement System handle?
The EV Group 40 Top-to-Bottom Side Measurement System handles wafers and substrates from two inches to eight inches.[1]
What stage configuration does the EV Group 40 Top-to-Bottom Side Measurement System use?
The EV Group 40 Top-to-Bottom Side Measurement System uses a manual alignment stage.[1]
What type of control or computing platform is part of the EV Group 40 Top-to-Bottom Side Measurement System?
The EV Group 40 Top-to-Bottom Side Measurement System uses a PC-based measurement system.[1]
Not publicly documented
The following facts about the 40 Top-to-Bottom Side Measurement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 40 Top-to-Bottom Side Measurement are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 40 Top-to-Bottom Side Measurement are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 40 Top-to-Bottom Side Measurement are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 40 Top-to-Bottom Side Measurement is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 40 Top-to-Bottom Side Measurement are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]web.archive.org — evgroup.com (Sep 8, 2011)web.archive.org
Last updated Oct 10, 2026.
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