Esec

E142

Packaging & Bonding 4” to 12”Esec E142 family

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EsecE142

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Wafer size

4” to 12”

Performance

8 μm @3s (High Accuracy Mode)^[1]

What it is

The Esec E142 is a strip mapping option for Esec die bonders. The strip mapping system is available on the Esec 2100 platform, including the Esec 2100 FC hS flip chip bonder and the Esec 2100 SC die bonder. The Esec E142 enables the bonder to recognize and align to strip positions for accurate die placement.^[1]

What do the numbers mean?

Wafer handling1

Wafer size: 4” to 12”^[1]

Performance1

Bonding accuracy: 8 μm @3s (High Accuracy Mode)^[1]

Configuration & options7

Associated platform: Esec 2100 FC hS^[1]
Option name: E142 strip mapping^[1]
Bonding method: Flip Chip Bonding^[1]
Min. cycle time: 240 ms (incl. dip fluxing)^[1]
Frame size: 6", 8” and 12"^[1]
Die size: 0.2 (with small die kit) to 20 mm^[1]
Die thickness: ≥ 0.05 mm / ≥ 2 mils (thinner on request)^[1]

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Not publicly documented

Field notes

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Frequently asked questions

What is the Esec E142?

The Esec E142 is a strip mapping option for Esec die bonders.^[1]

What does the Esec E142 strip mapping enable?

The Esec E142 strip mapping enables the bonder to recognize strip alignment and adjust die placement based on the strip map data.^[1]

Not publicly documented

The following facts about the E142 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the E142 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the E142 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the E142 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the E142 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the E142 is not on record.
Answerable by: an OEM datasheet or a fab qualification report