Electroglas
EG 4090 u Automatic Wafer
Plate 01Electroglas EG 4090u Prober
Gerard Oliver DunneWatch on YouTubePlate 02Electroglas EG4090u Prober System
Gustavo OrtegaWatch on YouTube
Wafer size
Wafer Profiler Kit
Power
220VAC, 50/60 Hz, Single Phase[6]
Performance
PTPA (Probe to Pad Alignment), PTPO[6]
Optics
Dual Optic Bridge CCD Camera Assembly[6]
How it works
The EG 4090 u includes a right-side single cassette loader. A display control module runs Windows EGC version 7 or higher and is accessed through an LCD touch screen monitor. Alignment is supported by Probe to Pad Alignment (PTPA) and PTPO features. A scrub pad is also included. The tester interface supports RS-232, GPIB, and TTL. The input voltage is 220 VAC, 50/60 Hz, single phase.[6]
What do the numbers mean?
Power & electrical2
Wafer handling11
Optics & imaging4
Performance2
- PTPA (Probe to Pad Alignment), PTPO[6]
Control & software5
Configuration & options8
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Electroglas EG 4090 u Automatic Wafer Prober | — | — | — | Equipment inventory listing[6] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of probe cards are used in such systems?General reference — not yet source-verified
Probe cards can be of various types, including cantilever, membrane, vertical, or micro-electromechanical systems (MEMS) based, each suited to different pitch, frequency, and contact force requirements. The card is chosen based on the device under test.
What factors affect the throughput of an automatic wafer prober?General reference — not yet source-verified
Throughput is influenced by wafer handling speed, alignment time, stepping rate, contact settling time, and the number of test sites contacted per touchdown. Advanced probers optimize these steps to maximize the number of dies tested per hour.
Why is temperature control important in wafer probing?General reference — not yet source-verified
Many semiconductor devices must be tested under specified temperature conditions to verify performance across the operating range. Automatic probers can incorporate heated or cooled chucks to maintain the wafer at temperatures from well below ambient to elevated levels.
Not publicly documented
The following facts about the EG 4090 u Automatic Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the EG 4090 u Automatic Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the EG 4090 u Automatic Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EG 4090 u Automatic Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EG 4090 u Automatic Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the EG 4090 u Automatic Wafer are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]inventory listing
- [6]inventory listing
- [7]Equipment inventory listing
Last updated Oct 1, 2026.
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