Waferpedia

Comparison ledger

EG 4090 u Automatic Waferversus1070

Electroglas EG 4090 u Automatic Wafer, Signatone 1070, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1070Signatone
OEMElectroglasSignatone
CategoryTest & ProbeTest & Probe
Wafer sizeWafer Profiler Kit—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyElectroglas EG 4090Signatone 1070
Cited variants
  • Electroglas EG 4090 u Automatic Wafer Prober[1]
—
Specifications
ConfigurationFor Parts[2]—
Temperature RangeAmbient ~ +130 degree C[1]—
Wafer sizeWafer Profiler Kit[1]—
Voltage220VAC, 50 / 60 Hz & Single Phase Input Voltage[1]—
TypeAutomatic Wafer Prober[3]—
Wafer Stage Size8 inch X-Y Stage[1]—
Hot Chuck Size8 inch Standard Hot Chuck Top Assy[1]—
Hot Chuck Temperature RangeAmbient ~ +130°C[1]—
Vision ModuleDual Optic Bridge CCD Camera Assembly[1]—
Wafer Profiler KitIncluded[1]—
Ring Carrier PlateRC 2[1]—
Probe Card HolderRTGR 2[1]—
Cassette LoaderRight Side Single Cassette Loader[1]—
Control ModuleDisplay Control Module with Windows EGC Version 7 or Higher[1]—
DisplayLCD Touch Screen Monitor[1]—
Z-StagePZ 7 Z-Stage, 0.125 MIL or 0.25 MIL Z Resolution[1]—
AlignmentPTPA (Probe to Pad Alignment), PTPO[1]—
InterfacesRS 232, GPIB & TTL Tester Interface[1]—
Input Voltage220VAC, 50/60 Hz, Single Phase[1]—
Scrub PadIncluded[1]—
Make—Signatone[4]
Model—1070[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing