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Disco

DAG 810 Ring Removal

Disco DAG 810 family
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DiscoDAG 810 Ring Removal
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What it is

The Disco DAG 810 Ring Removal is a compact automatic grinder for workpieces up to 8 inches in diameter. The DAG 810 is a single-axis machine with one spindle and one chuck table.[2][1]

How it works

The DAG 810 uses anomalous in-feed grinding with wafer rotation. The machine uses a diamond wheel and a high-rigidity, low-vibration spindle to perform grinding.[2]

The DAG 810 includes a touch screen and graphical user interface for operation and on-screen status display. The machine supports in-feed grinding and creep-feed grinding as specified options or user-specified configurations.[2]

Where it fits in the process flow

The DAG 810 is used for processing silicon and compound semiconductors for analysis. The machine is also used for resin, lithium tantalate, lithium niobate, green ceramics, and sapphire.[2]

Applications

The DAG 810 processes silicon and compound semiconductors for analysis. The machine also grinds resin for CSP and WL-CSP and improves the planarity of lithium tantalate and lithium niobate.[2]

The DAG 810 processes green ceramics and sapphire. The machine is also intended for a wide variety of electronic components and hard or brittle substrates.[2]

What do the numbers mean?

Power & electrical1

Spindle rated output
4.2 kW[2]
Accurate?

Wafer handling3

Supported workpiece size
Up to Φ8 inch (Φ4, 5, 6, 8 inch with universal chuck table)[2]
Accurate?
Grinding method
Anomalous in-feed grinding with wafer rotation[2]
Accurate?
Wafer size (ring removal variant)
6 inch (convertible to 8 inch)[1]
Accurate?

Dimensions & facilities2

Equipment dimensions (W × D × H)
600 × 1,700 × 1,780 mm[2]
Accurate?
Equipment weight
Approx. 1,300 kg[2]
Accurate?

Configuration & options4

Convertible to 8"[1]
Accurate?
Grinding wheel diameter
Φ200 mm[2]
Accurate?
Spindle rated torque
5.9 N·m[2]
Accurate?
Spindle rotation speed range
1,000 – 7,000 min⁻¹[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Spindle rated output4.2 kW[2]

Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the DAG 810 Ring Removal are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAG 810 Ring Removal are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DAG 810 Ring Removal are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DAG 810 Ring Removal are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DAG 810 Ring Removal are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DAG 810 Ring Removal is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]disco.com.sg — disco.com.sgdisco.com.sg
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Last updated Oct 10, 2026.

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